Gas sensor package structure

A gas sensor and packaging structure technology, applied in the direction of material impedance, etc., can solve the problems of large environmental impact, places that are not suitable for accurate measurement requirements, output parameters cannot be determined, etc., and achieve the effect of expanding application scenarios

Inactive Publication Date: 2018-11-16
佛山市澄澜点寸科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Semiconductor gas sensors also have the following disadvantages: poor stability and greater environmental impact; especially, the selectivity of each sen

Method used

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  • Gas sensor package structure
  • Gas sensor package structure

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Example Embodiment

[0015] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The drawings show preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0016] The present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0017] See figure 1 , figure 1 Is a schematic longitudinal cross-sectional view of the gas sensor packaging structure of the present invention, figure 2 It is a schematic diagram of the transverse cross-section of the substrate in the gas sensor packaging structure of the present invention. The present invention provides a g...

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Abstract

The invention provides a gas sensor package structure. The gas sensor package structure packages a gas sensor chip. The gas sensor package structure comprises a substrate, a package housing, a gas sensing chip and a conductive package connection layer. The gas sensing chip is arranged on the substrate. The package housing is provided with a vent hole and an opening. The shape of the substrate is corresponding to the opening of the package housing so that the substrate is received by the opening. The conductive package connection layer is arranged between the package housing and the substrate.An electrode of the gas sensing chip is arranged at the junction of the bottom and the side. The conductive package connection layer comprises an insulating portion and a conductive portion isolated from the insulating portion. The conductive portion extends from the electrode position of the gas sensing chip to the plane where the substrate base surface and package housing opening are located sothat the problem that the existing gas sensor is packaged under different scene requirements is solved and the application range of the gas sensor is widened.

Description

technical field [0001] The invention belongs to the technical field of gas sensors, in particular to a gas sensor packaging structure. Background technique [0002] A gas sensor is a converter that converts a certain gas volume fraction into a corresponding electrical signal. The probe head conditions the gas sample through the gas sensor, usually including filtering out impurities and interfering gases, drying or cooling the display part of the instrument. Gas sensors are divided into: semiconductor gas sensors, electrochemical gas sensors, catalytic combustion gas sensors, thermal conductivity gas sensors, infrared gas sensors, etc. Semiconductor gas sensors use some metal oxide semiconductor materials. It is manufactured on the principle that the rate changes with the change of the ambient gas composition. For example, the alcohol sensor is prepared by using the principle that the resistance of tin dioxide will decrease sharply when it encounters alcohol gas at high tem...

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Application Information

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IPC IPC(8): G01N27/02
CPCG01N27/02
Inventor 徐雪华
Owner 佛山市澄澜点寸科技有限公司
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