Heat-conducting structure of aluminum alloy-inlaid graphene-based composite substrate and manufacturing method of heat-conducting structure

A composite material, graphene-based technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of low longitudinal thermal conductivity of graphene-based heat dissipation materials and limit the comprehensive heat dissipation capacity, so as to improve heat transfer efficiency, expand application scope, The effect of increasing the contact area

Inactive Publication Date: 2018-11-30
深圳烯创技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the above-mentioned problem that the low longitudinal thermal conductivity of the graphene-based heat dissipation material limits its comprehensive heat dissipation capability, the present invention provides a heat conduction structure with an aluminum alloy embedded in a graphene-based composite material substrate and a manufacturing method thereof, which can greatly improve the graphene-based heat dissipation performance. The longitudinal heat conduction efficiency of the composite material substrate, thereby improving its overall heat dissipation efficiency

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  • Heat-conducting structure of aluminum alloy-inlaid graphene-based composite substrate and manufacturing method of heat-conducting structure
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  • Heat-conducting structure of aluminum alloy-inlaid graphene-based composite substrate and manufacturing method of heat-conducting structure

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Embodiment 1

[0035] This embodiment provides a method for manufacturing an aluminum alloy inlaid in a graphene-based composite material substrate, and the specific implementation steps are as follows:

[0036]1) Select a graphene-based composite material with an area of ​​200×150mm and a thickness of 10mm. In this composite material, graphene accounts for 90v%, copper accounts for 10v%, and the graphene is oriented along the XY plane direction, and the plane heat of the substrate The conductivity is ~1200W / (m.K), and the vertical thermal conductivity is ~5W / (m.K). Using a CNC machine tool and a milling cutter, drill a through hole with a trapezoidal side section on the graphene-based composite material substrate. The height of the hole is the same as the thickness of the substrate. The size of the upper surface of the hole is 15×15mm, and the size of the lower surface is 20mm. ×20mm, the position of the hole is in the middle of the graphene substrate.

[0037] 2) Preparation of aluminum a...

Embodiment 2

[0044] This embodiment provides a method for manufacturing an aluminum alloy inlaid in a graphene-based composite material substrate, and the specific implementation steps are as follows:

[0045] 1) Select a graphene composite substrate with an area of ​​200×150mm and a thickness of 10mm. The material contains 15v% copper and the rest is graphene. The graphene is oriented along the XY plane direction, and the plane thermal conductivity of the substrate is ~1100W / (m.K), the vertical thermal conductivity is ~5~7W / (m.K). Using a CNC machine tool and a milling cutter, drill two holes with a trapezoidal side section on the graphene-based composite material substrate. The height of the holes is the same as the thickness of the substrate. The size of the upper surface of the other hole is 10×10mm, and the size of the lower surface is 25×25mm.

[0046] 2) Preparation of aluminum alloy blocks: 6061 aluminum material is selected, and the aluminum alloy blocks are prepared by wire-cutt...

Embodiment 3

[0052] This embodiment provides a method for manufacturing an aluminum alloy inlaid in a graphene-based composite material substrate, and the specific implementation steps are as follows:

[0053] 1) Select a graphene / carbon composite substrate with an area of ​​200×200mm and a thickness of 5mm, in which the graphene volume fraction is 90%, the carbon nanotube volume content is 10%, and the graphene is oriented along the XY plane direction. And the plane thermal conductivity of the substrate is ~1300W / (m.K), and the vertical thermal conductivity is ~3~6W / (m.K). Using a CNC machine tool and a milling cutter, a through-hole with a trapezoidal side section is drilled on the graphene-based composite substrate. The size of the upper surface of the hole is 15×15mm, and the size of the lower surface is 20×20mm.

[0054] 2) Preparation of aluminum alloy blocks: 6061 aluminum material is selected, and the aluminum alloy blocks are prepared by wire-cutting of CNC machine tools. A margin...

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Abstract

The invention discloses a heat-conducting structure of an aluminum alloy-inlaid graphene-based composite substrate and a manufacturing method of the heat-conducting structure. The heat-conducting structure comprises a graphene-based composite substrate and an aluminum block, wherein the graphene-based composite substrate is longitudinally perforated; and the aluminum block is inlaid into a hole ofthe graphene-based composite substrate. The method comprises the following steps of (1) longitudinally perforating the graphene-based composite substrate; (2) preparing the aluminum block; (3) carrying out surface metalization on the surface of the hole of the graphene-based composite substrate; (4) carrying out surface copper plating on the aluminum block of which the surface is polished; and (5) inlaying the copper-plated aluminum block into the hole of the graphene-based composite substrate of which the surface is metalized and obtaining the heat-conducting structure of the aluminum alloy-inlaid graphene-based composite substrate. Through the heat-conducting structure, the longitudinal heat-conducting efficiency of the graphene-based composite substrate can be greatly improved, therebyimproving the overall cooling efficiency.

Description

technical field [0001] The invention belongs to the technical field of material structure design, and relates to a heat conduction structure inlaid with aluminum alloy in a graphene-based composite material substrate and a manufacturing method thereof. Background technique [0002] With the increasing demand for device miniaturization and multi-function, the high integration of electronic devices has become the mainstream trend of its development. This also leads to an increasing power density of the device, and correspondingly more and more heat is generated. If the heat is not dissipated in time, the temperature of the device will gradually increase, thereby affecting its reliability and service life. Significant impact, especially in aerospace and defense. Deep space probes, various satellites, nuclear reactors, aircraft, laser weapons, missiles and other weapons and equipment all require efficient heat dissipation materials and structures. For example, the application ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 李宜彬孙贤贤余方祥赫晓东
Owner 深圳烯创技术有限公司
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