Etching method

Abstract

An embodiment of the invention provides an etching method which comprises the following steps: mounting a wafer on a sucking disc which is arranged in a chamber of an etching system with the wafer being surrounded by a focus ring; moving the focus ring vertically relative to the wafer to a first vertical position while the portions of the wafer are being etched, the first vertical position corresponding to a first etch direction; and moving the focus ring vertically relative to the wafer to a second vertical position while the portions of the wafer are being etched, the second vertical position corresponding to a second etch direction, the second vertical position being different from the first vertical position, the second etch direction being different from the first etch direction.

Description

technical field [0001] Embodiments of the present invention relate to an etching method, and in particular to an etching method using a focus ring. Background technique [0002] Semiconductor devices are used in various electronic applications such as personal computers, cell phones, digital cameras, and other electronic equipment. Semiconductor devices are usually manufactured by sequentially depositing insulating or dielectric layers, conductive layers, and semiconductor material layers on a semiconductor substrate and patterning the various material layers using photolithography and etching processes to form circuit components and elements on a semiconductor substrate . [0003] The semiconductor industry continues to improve the integration density of various electronic components (eg, transistors, diodes, resistors, capacitors, or the like) by continuing to reduce the size of the smallest features, which allows more components to be integrated into a given area. Howev...

AI Technical Summary

Problems solved by technology

However, as the minimum feature size decreases, additional issues arise in each process used and should be addressed

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