Nondestructive testing method for inner wall quality of micron through holes

Abstract

The invention relates to a method for detecting walls of micron holes, and in particular to a nondestructive testing method for the inner wall quality of micron through holes. The method comprises thesteps of fixing a to-be-tested micron hole sample in the middle of an electrolytic tank filled with a electrolyte solution and dividing the electrolyte solution in the electrolytic tank into two parts by the micron hole sample, wherein the intercommunication of the electrolyte solution can only be realized via the micron through hole sample; respectively inserting positive and negative electrodesof a direct current power source into the solution at both sides of the micron hole sample and forming an ion current path between the two electrodes through the micron hole after a voltage is applied; clamping a probe in the electrolytic tank on a propulsion device by a clamping device and pushing the probe into the micron hole through the propulsion device to detect the change situation of theblocked current when the probe enters the micron hole, thereby realizing the quality testing of the inner wall of the micron hole. The method disclosed by the invention has the beneficial effects thataccording to the detected signal change of the blocked current, the rapid, effective and nondestructive testing of the inner wall quality of the micron through holes is realized through analyzing current signals and the quality control in the product producing process is guaranteed.

Description

technical field [0001] The invention relates to a method for detecting the wall of a micron hole, and more particularly, to a method for nondestructive detection of the quality of the inner wall of a through hole of a micron hole. Background technique [0002] With the rapid development of the electronics industry, electronic technology is developing towards large-scale, highly integrated, and refined, and electronic equipment is becoming more and more complex. The fine processing quality directly affects the quality and cost of electronic products. [0003] At present, there is no fast and effective detection method for the porosity quality of the inner wall of the micron through-hole (including the roughness of the hole wall, the integrity of the hole wall, and the thickness of the hole). Existing detection methods for micron holes are based on optical principles. These methods can only detect the places where direct light can reach, so they can only detect attributes suc...

AI Technical Summary

Problems solved by technology

Existing detection methods for micron holes are based on optical principles. These methods can only detect the places where direct light can reach, so they can only detect attributes such as hole shape, diameter, and position. However, for defects on the inner wall of the hole (such as small burrs, threads, depressions on the inner wall of the hole, etc.) cannot be effectively detected, and these defects directly affect the subsequent processing quality of the product and the quality of the finished product

For example, in the quality inspection of the inner wall of the through-hole of the PCB micro-hole, the PCB slice analysis technology can directly observe the shape of the hole and the structure of the material inside the board under the microscope, but the production of the slice needs to destroy the production board, and the production process is many and takes a long time. Production efficiency, increase production input cost

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