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Brittle material substrate breaking apparatus and substrate breaking method using the apparatus

A brittle material substrate and splinter technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of contaminated components, waste of ear material, uneven cutting edges, etc.

Inactive Publication Date: 2019-01-18
YF CONSULTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these splitting processes all suffer from the disadvantages of ear material waste, uneven kerf edges, and even contamination of components on the substrate.

Method used

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  • Brittle material substrate breaking apparatus and substrate breaking method using the apparatus
  • Brittle material substrate breaking apparatus and substrate breaking method using the apparatus
  • Brittle material substrate breaking apparatus and substrate breaking method using the apparatus

Examples

Experimental program
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Embodiment 1

[0061] First, see Figure 1A , which shows a partial schematic view of a brittle material substrate splitting device 10, which includes a platform 100, a pre-cutting device 200, and a linear splitting device 300 as shown in FIGS. 1B-1C. Wherein, the platform 100 is used to carry a brittle material substrate 200 having an upper surface 201 and a lower surface 202, the platform 100 has a front 100A and a back (not shown) opposite to the front 100A, and the front 100A includes multiple protruding structures 150 , wherein the brittle material substrate 200 is placed on the plurality of protruding structures 150 on the platform 100 through its lower surface 202 .

[0062] In this embodiment, the above-mentioned brittle material substrate 200 is a glass substrate. Only in other embodiments according to the present invention, the brittle material substrate can also be a semiconductor substrate, such as a silicon wafer, a sapphire substrate, a quartz substrate, a silicon carbide subst...

Embodiment 2

[0066] First, see Figure 2A , which shows a partial schematic view of another brittle material substrate splitting device 20, which includes a carrier 125, a pre-cutting device 250 and, for example, Figures 2A to 2B A linear split device 300 is shown. The carrier 125 is used to carry the brittle material substrate 200 having an opposite upper surface 201 and a lower surface 202, and the carrier 125 includes a first platform 121 and a second platform 122 and a bridge connecting the first platform 121 and the second platform 122 The connection structure 123, there is a first interval 124 between the first platform 121 and the second platform 122, and the first platform 121 and the second platform 122 are located on the same horizontal plane, wherein the first platform 121 Both the second platform 122 include a plurality of protruding structures 150, and the brittle material substrate 200 is placed on the first platform 121 and the second platform 122 through the lower surface...

Embodiment 3

[0071] First, see Figure 3A , which shows a partial schematic view of another brittle material substrate splitting device 30 , which includes a carrier 125 , a pre-cutting device 250 and a linear splitting device 300 . The carrier 125 is used to carry the brittle material substrate 200 having an opposite upper surface 201 and a lower surface 202, and the carrier 125 includes a first platform 121 and a second platform 122 and a bridge connecting the first platform 121 and the second platform 122 The connection structure 123, there is a first interval 124 between the first platform 121 and the second platform 122, and the first platform 121 and the second platform 122 are located on the same horizontal plane, wherein the first platform 121 Both the second platform 122 include a plurality of protruding structures 150, and the brittle material substrate 200 is placed on the first platform 121 and the second platform 122 through the lower surface 202. on the protruding structure ...

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PUM

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Abstract

The invention discloses a brittle material substrate breaking apparatus and substrate breaking method using the apparatus. The device includes a platform for carrying a substrate of a brittle materialhaving opposing upper and lower surfaces, wherein the platform includes a plurality of protruding structures, and the substrate of the brittle material is placed on the plurality of protruding structures on the platform through the lower surface; a pre-cutting device disposed above the platform, and the pre-cutting device can pre-cut at a predetermined position on the upper surface of the brittlematerial substrate, and form a pre-cutting track having a depth less than the thickness of the brittle material substrate; and a linear splitting device disposed above the platform, and the linear splitting device can move toward the upper surface of the brittle material substrate after being aligned with the pre-cutting track, so that the brittle material substrate is broken into secondary brittle substrates, in smaller area, by the tension of the linear splitting device. The apparatus can increase utilization rate of the brittle material substrate.

Description

technical field [0001] The invention relates to a brittle material substrate splitting device and a splitting method using the device. Background technique [0002] At present, in the semiconductor industry and the panel industry, after the relevant process is completed, the substrate must be further processed by dicing and splitting to split the substrate into smaller sub-substrates. Among them, the common method of splitting is to form pre-cut grooves on the substrate first, and then use the impact ear material area or apply instantaneous stress from the front or back of the pre-cut grooves, so that the original substrate splits into smaller areas. substrate. However, these splitting processes all suffer from the disadvantages of wasted material, uneven notched edges, and even contamination of components on the substrate. In view of this, the industry is eagerly looking forward to developing a splitting device suitable for the semiconductor industry or the panel industry...

Claims

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Application Information

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IPC IPC(8): H01L21/78H01L21/67
CPCH01L21/67092H01L21/78
Inventor 谢孟学苏志鸿
Owner YF CONSULTING CO LTD