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Method for manufacturing V-cut-free and stamp-hole-free multi-splicing stepped-slot circuit board

A manufacturing method and stepped groove technology are applied in printed circuit manufacturing, simultaneous processing of multiple printed circuits, printed circuits, etc., which can solve problems such as complicated process, affecting the appearance of circuit boards, and enlarged size, so as to simplify the process flow and reduce the Effect of Lamination Cost

Active Publication Date: 2019-02-01
SHENZHEN BOMIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For some circular, oval and other irregular boards, stamp holes are usually added. The stamp holes will be added between the corners of the PCB board that are not practically used and the effective board area or functional board area. The board is opened along the stamp hole, but generally burrs will be left, which will affect the appearance of the circuit board, and the size will also increase accordingly due to the burrs
Moreover, in the process of making the stepped groove plate, it is necessary to open windows for the PP and core board, fill with silica gel, buffer during pressing, remove the cover with controlled depth of the outer layer, take out the filler, and expose the blind groove pad, etc. The process is very complicated.

Method used

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  • Method for manufacturing V-cut-free and stamp-hole-free multi-splicing stepped-slot circuit board
  • Method for manufacturing V-cut-free and stamp-hole-free multi-splicing stepped-slot circuit board

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Embodiment Construction

[0042] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0043] In view of the need to make V-cut grooves and stamp holes during the imposition making process of traditional circuit boards with dimensions less than 60mm*60mm, which will cause board edge burrs, affect the appearance of circuit boards, and such small-sized stepped groove circuit boards need to be pressed and other processes To solve the complicated problem, the present invention provides a method for manufacturing a circuit board with multiple stepped grooves without making V-cuts and stamp holes.

[0044] The method of the present invention specifically comprises:

[0045] Firstly, cut t...

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Abstract

The invention provides a method for manufacturing a V-cut-free and stamp-hole-free multi-splicing stepped-slot circuit board. The method comprises the following steps: making a first sub-board; makinga second sub-board; and making a double-sided adhesive tape and enabling the first sub-board and the second sub-board to be bonded correspondingly to form a spliced board. According to the invention,after the sub-board making is completed, stamping is carried out on the outer side of a unit board by two kinds of pushing membranes to form an annular slot, so that a problem of having no burr at the edge of the multi-splicing board is solved; and the dimension changing of the sub-board is controlled precisely, thereby bringing convenience for assembling of the downstream procedure. After the sub-board making is completed, the sub-boards are adhered by usng the special double-sided adhesive tape and thus the traditional pressing process of making a stepped slot is replaced, so that the pressing cost is lowered; and the complicated NO-flowPP windowing or depth-controlling uncovering flow is saved, so that the process is simplified.

Description

technical field [0001] The invention belongs to the field of circuit board manufacturing, and in particular relates to a method for manufacturing a circuit board free of V-cut and multiple stamp holes. Background technique [0002] During the forming process of circuit boards, because the boards are too small for SMT in the downstream process, it is inconvenient to punch and transfer, so boards with dimensions smaller than 60mm*60mm are not suitable for single 1PCS shipment. In order to improve the efficiency of SMT automated production and reduce production costs, customers in downstream processes usually require circuit boards to be delivered in contiguous pieces, and then divided into boards after SMT packaging. [0003] At present, for boards with regular shapes such as rectangles or squares, V-cut is mostly used to make the boards. The accuracy of V-cut is related to the cutter, V-cut depth, excess thickness, cutting deviation, etc. There will also be slight variations...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0097
Inventor 徐俊子张长明王强徐缓黄建国
Owner SHENZHEN BOMIN ELECTRONICS