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A signal board interconnection device and interconnection method thereof

A signal board and fine-tuning device technology, which is applied in the installation of support structures, instruments, and electrical equipment structural parts, etc. Effect

Active Publication Date: 2022-02-18
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Since the connection method is an overlapping connection, the heat generated is not easy to dissipate, which will have a very large adverse effect on the heat dissipation of the backplane

Method used

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  • A signal board interconnection device and interconnection method thereof
  • A signal board interconnection device and interconnection method thereof
  • A signal board interconnection device and interconnection method thereof

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Embodiment Construction

[0024] In order to clearly illustrate the technical characteristics of this program, the following specific implementation methods, combined with its attached Figures 1 to 4 , the present invention is described in detail. It should be noted that components illustrated in the figures are not necessarily drawn to scale. The present invention omits descriptions of well-known components and well-known technologies in order to avoid unnecessarily limiting the present invention.

[0025] An interconnection device for a signal board, comprising a backplane 1 and a fine-tuning device 2; the backplane 1 includes a horizontal plate 11 and a vertical plate 12, and a vertical plate 12 is provided at one end of the horizontal plate 11, and the horizontal plate 12 The lower end of the plate 11 fixes the vertical plate 12, and the horizontal plate 11 is provided with a plurality of first chute 111, and each first chute 111 is connected with a low-speed connector 3, and the low-speed connec...

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Abstract

A signal board interconnection device and its interconnection method belong to the technical field of server signal board interconnection, and its structure includes a backboard and a fine-tuning device; The lower end of the horizontal plate fixes the vertical plate, and the horizontal plate is provided with a plurality of first chute, and each first chute is connected with a low-speed connector, and the low-speed connector is arranged on the front side of the horizontal plate, and the two sides of each first chute A fine-tuning device is provided on each side, and the fine-tuning device is arranged on the same side as the low-speed connector. There are multiple second slide slots on the vertical plate, and each second slide slot is connected to a low-speed connector. The low-speed connection The device is arranged on the rear side of the vertical board, and a fine-tuning device is arranged on both sides of each second chute, and the fine-tuning device is arranged on the rear side of the vertical board; a method for interconnecting signal boards, comprising the following steps: (1) IO board Insert the vertical plate, (2) the CPU board is inserted into the horizontal plate, (3) the IO board and the CPU board are fine-tuned and inserted. The invention is used to solve the technical problem of heat dissipation on the backplane.

Description

technical field [0001] The invention relates to the technical field of server signal board interconnection, in particular to a signal board interconnection device and an interconnection method thereof. Background technique [0002] With the development of technology, the density of servers continues to increase, and at the same time, the signal rate is also increasing. Currently, signal transmission mainly uses traditional orthogonal connectors. The connection method of the traditional orthogonal connector is as follows: the two opposite sides of the backplane provided with slots are respectively plugged with a male connector, and each of the male connectors is respectively plugged with a female connector, and each The female connectors each connect to an interconnect board. Since the connection mode is an overlapping connection, the generated heat is not easy to dissipate, which will have a very large adverse effect on the heat dissipation of the backplane. Contents of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/183G06F1/20H05K7/1492H05K7/1438
Inventor 宗艳艳贡维
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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