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A method for quickly evaluating chip design and production cost

A production cost and chip design technology, applied in the field of rapid evaluation of chip design and production cost, can solve the problem that the number of samples becomes extremely valuable, and achieve the effect of reducing timeliness

Active Publication Date: 2019-02-22
苏州芯联成软件有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the application side of the chip, some chips are customized products that need to be obtained by disassembling the machine; some chips need to be applied to the design manufacturer or the application manufacturer, so the number of samples becomes extremely valuable

Method used

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  • A method for quickly evaluating chip design and production cost
  • A method for quickly evaluating chip design and production cost

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Embodiment Construction

[0046] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0047] Such as figure 1 As shown, embodiments of the present invention include:

[0048] A method for quickly evaluating chip design and production costs. The metal layers of the chip are the fifth metal layer, the fourth metal layer, the third metal layer, the second metal layer and the first metal layer from top to bottom. On the basis of destroying its entire circuit planar structure, longitudinal dissection of any corner of the chip is used to confirm the metal layer of the chip, and then combined with chemical ...

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Abstract

The invention discloses a method for quickly evaluating chip design and production cost. The metal layer of the chip is composed of a fifth metal layer, a fourth metal layer, a third metal layer, a second metal layer and a first metal layer from top to bottom. On the basis of not destroying the whole circuit plane structure of the chip, the chip is longitudinally dissected to confirm the metal layer of the chip, and then the metal layer is quickly etched and delaminated with a chemical etching reagent. Through the above, the invention provides a method for quickly evaluating chip design and production cost, on the basis of not destroying the whole circuit plane structure of the chip, using a longitudinal anatomy of either corner of the chip, after confirmation of the metal layer, Combinedwith chemical etching reagent, the chip design and production cost can be evaluated in a short period of time on the number of chip used, which greatly reduces the impact of poor timeliness caused byless chips and slow delamination, and is conducive to market research and R & D decisions of chip products.

Description

technical field [0001] The invention relates to the field of chips, in particular to a method for quickly evaluating chip design and production costs. Background technique [0002] Integrated circuit design companies are an indispensable means of chip design and production cost evaluation and analysis. At the beginning of the design project approval, it is necessary to conduct a series of analyzes on the mainstream chips in the market to be involved in order to obtain certain technical information and price and cost estimates; when it is sold in the market, it is necessary to design and produce the cost of its competing products Evaluation and analysis to obtain information on its competitive advantages and disadvantages in the market; through this analysis method, certain layout design patents can be avoided, and on the contrary, first-hand information on some layout-infringing chips can also be obtained. [0003] On the application side of chips, some chips are customized...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06Q30/02G06Q50/04G01N1/28G01N1/32G01N1/34G01N21/84G01N23/2202G01N23/2251
CPCG01N1/286G01N1/32G01N1/34G01N21/84G01N23/2202G01N23/2251G06Q30/0206G06Q50/04Y02P90/30
Inventor 王亮左振宏
Owner 苏州芯联成软件有限公司