A Quick Method for Evaluating Chip Design and Production Costs

Abstract

The invention discloses a method for rapidly evaluating chip design and production cost. The metal layers of the chip are the fifth metal layer, the fourth metal layer, the third metal layer, the second metal layer and the first metal layer from top to bottom. On the basis of not destroying the entire circuit plane structure of the chip, longitudinal dissection of any corner of the chip is used to confirm the metal layer of the chip, and then combined with chemical etching reagents to quickly etch and remove the layer. Through the above, the method for quickly evaluating chip design and production cost of the present invention adopts longitudinal dissection of any corner of the chip without destroying the entire circuit planar structure of the chip, and after confirming its metal layer, combined with chemical The rapid etching and delayering of the corrosive reagent can evaluate the design and production cost of the chip in a short period of time based on the number of chips used, which greatly reduces the impact of poor timeliness caused by fewer chips and slow delayering. , which can be beneficial to the market research and R&D decision-making of chip products.

Description

technical field [0001] The invention relates to the field of chips, in particular to a method for quickly evaluating chip design and production costs. Background technique [0002] Integrated circuit design companies are an indispensable means of chip design and production cost evaluation and analysis. At the beginning of the design project approval, it is necessary to conduct a series of analyzes on the mainstream chips in the market to be involved in order to obtain certain technical information and price and cost estimates; when it is sold in the market, it is necessary to design and produce the cost of its competing products Evaluation and analysis to obtain information on its competitive advantages and disadvantages in the market; through this analysis method, certain layout design patents can be avoided, and on the contrary, first-hand information on some layout-infringing chips can also be obtained. [0003] On the application side of chips, some chips are customized...

AI Technical Summary

Problems solved by technology

[0003] On the application side of the chip, some chips are customized products that need to be obtained by disassembling the machine; some chips need to be applied to the design manufacturer or the application manufacturer, so the number of samples becomes extremely valuable

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