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Calculation unit, radiator and calculation unit assembly

A computing unit and heat sink technology, applied in the computer field, can solve problems such as inseparability and affecting the performance of on-board computing units, and achieve the effect of reducing procurement and management costs

Pending Publication Date: 2019-03-15
BAIDU ONLINE NETWORK TECH (BEIJIBG) CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The on-board computing unit is the hardware carrier of autonomous driving technology, which can provide powerful computing power for autonomous driving and collect data from various sensors. With the increasing development of autonomous driving technology, the computing demand for on-board computing units is also increasing. The on-board computing unit has high heat generation. If the heat cannot be dissipated in time, it will seriously affect the performance of the on-board computing unit.
[0003] In the existing self-driving on-board system, the heat dissipation method of the on-board computing unit is that the shell of the computing unit and the radiator are set as an integrated structure, and the two cannot be separated.

Method used

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  • Calculation unit, radiator and calculation unit assembly
  • Calculation unit, radiator and calculation unit assembly
  • Calculation unit, radiator and calculation unit assembly

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Embodiment Construction

[0030] In order to enable those skilled in the art to better understand the technical solution of the present invention, the vehicle-mounted computing unit, radiator and vehicle-mounted computing unit assembly provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0031] Example embodiments will be described more fully hereinafter with reference to the accompanying drawings, but may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0032] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0033] The terminology used herein is for describing particular embodiments only and is not intended to limit the present disclosure. As u...

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Abstract

A vehicle-mounted computing unit includes a first heat dissipation interface disposed on a housing of the vehicle-mounted computing unit to be disposed opposite to a second heat dissipation interfaceof a heat sink, and a second heat dissipation interface disposed on the housing. A first mounting structure provided on the vehicle-mounted computing unit housing for cooperating with a second mounting structure of the heat sink to removably mount the heat sink on the vehicle-mounted computing unit. A radiator and an on-board computing unit assembly are also provided.

Description

technical field [0001] The embodiments of the present disclosure relate to the field of computer technology, and in particular to a vehicle-mounted computing unit, a radiator, and components of a vehicle-mounted computing unit. Background technique [0002] The on-board computing unit is the hardware carrier of autonomous driving technology, which can provide powerful computing power for autonomous driving and collect data from various sensors. With the increasing development of autonomous driving technology, the computing demand for on-board computing units is also increasing. The on-board computing unit has high heat generation, if the heat cannot be dissipated in time, it will seriously affect the performance of the on-board computing unit. [0003] In the existing vehicle-mounted autonomous driving system, the heat dissipation method of the vehicle-mounted computing unit is that the housing of the computing unit and the radiator are set as an integrated structure, and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 张扬
Owner BAIDU ONLINE NETWORK TECH (BEIJIBG) CO LTD
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