Haptic feedback module, preparation method thereof and touch control device thereof

A technology of tactile feedback and thickness direction, applied in mechanical mode conversion, piezoelectric devices/electrostrictive devices, instruments, etc., can solve the problem of no tactile feedback of piezoelectric units

Active Publication Date: 2019-03-22
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the reliability test of the existing tactile feedback module, when the voltage is high, there is an arc discharge phenomenon at the electrical connection between the piezoelectric unit and the circuit board, so that the piezoelectric unit has no tactile feedback function

Method used

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  • Haptic feedback module, preparation method thereof and touch control device thereof
  • Haptic feedback module, preparation method thereof and touch control device thereof
  • Haptic feedback module, preparation method thereof and touch control device thereof

Examples

Experimental program
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Embodiment Construction

[0031] Such as figure 1 As shown, the touch device 100 includes a cover plate 20 and a plurality of tactile feedback modules 10 . The cover 20 defines a touch surface 21 for inputting touch operations. The tactile feedback module 10 is disposed on a side of the cover 20 away from the touch surface 21 . The touch control device 100 can be a mobile phone, a tablet computer, a smart wearable device (such as a smart watch) and the like.

[0032] Such as figure 2 As shown, the tactile feedback module 10 includes a circuit board 11 , a first isotropic conductive film (ICF) 12 , a second isotropic conductive film 13 , a piezoelectric unit 14 and an insulating film 15 .

[0033] Such as figure 2 As shown, the circuit board 11 includes a substrate 111 , a first connection pad 112 and a second connection pad 113 . The first connection pads 112 and the second connection pads 113 are located on the same surface of the substrate 111 , and the first connection pads 112 and the second...

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PUM

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Abstract

A haptic feedback module comprises a circuit board and a piezoelectric unit. The circuit board includes a first connection pad spaced apart and a second connection pad. The piezoelectric unit includesa piezoelectric layer, a first electrode, and a second electrode. The piezoelectric layer has an opposite first surface and a second surface, the first surface being adjacent to the circuit board. The first electrode extends from the second surface of the piezoelectric layer to the first surface of the piezoelectric layer in a thickness direction of the piezoelectric layer. The second electrode is formed on at least the first surface of the piezoelectric layer and is disposed at an insulating interval from the first electrode. The circuit board applies voltages to the first electrode and thesecond electrode through the first connection pad and the second connection pad, respectively. The piezoelectric layer generates haptic feedback according to the voltage. Also provided are a preparation method of the haptic feedback module and a touch control device using the haptic feedback module.

Description

technical field [0001] The present invention relates to the field of touch technology, in particular to a tactile feedback module, its preparation method and a touch device using the touch feedback module. Background technique [0002] Generally, the tactile feedback module includes a piezoelectric unit and a circuit board electrically connected to the piezoelectric unit. [0003] However, in the reliability test of the existing tactile feedback module, when the voltage is high, there is an arc discharge phenomenon at the electrical connection between the piezoelectric unit and the circuit board, so that the piezoelectric unit has no tactile feedback function. Contents of the invention [0004] The present invention provides a tactile feedback module, comprising: [0005] A circuit board, including a first connection pad and a second connection pad spaced apart from the first connection pad; [0006] a first isotropic conductive adhesive layer disposed on the first conne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/01G06F3/041
CPCG06F3/016G06F3/0414G06F2203/04103H10N30/877H10N30/87H10N30/00H10N30/072G06F3/0416
Inventor 涂煜杰巫宜庭
Owner INTERFACE TECH CHENGDU CO LTD
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