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A method and system for position control of smt patch components

A technology for patch components and control methods, which is applied in the direction of electrical components, electrical components, and electrical components to assemble printed circuits to achieve the effects of high patch precision, improved efficiency, and fast and effective positioning.

Active Publication Date: 2020-09-08
深圳捷创电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the process accessories required by the two processing methods are completely different, and combined with the method of stencil printing, only one of the processing technologies can be used for the SMD components arranged on the same side of the single board.

Method used

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  • A method and system for position control of smt patch components

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Embodiment Construction

[0030] The concrete implementation of the present invention is described in detail below, it is necessary to point out here that the following implementation is only used for further description of the present invention, and can not be interpreted as limiting the protection scope of the present invention. Some non-essential improvements and adjustments still belong to the protection scope of the present invention.

[0031] The present invention provides a method and system for controlling the position of SMT patch components, wherein the specific process of the control method is as attached figure 1 shown.

[0032] First, place an order according to the customer's requirements. The customer can send the raw materials or the processing factory can purchase the raw materials on behalf of the customer. After the raw materials are purchased, they will be put into the warehouse, and then the materials will be counted and inspected according to the process requirements, and the mate...

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Abstract

An SMT chip component position control method and system are provided. The method comprises the following steps: preparing raw materials according to requirements, counting and checking the materialsaccording to process requirements, and preparing the materials according to requirements; assigning different packaging numbers according to the attribute of a chip component, summarizing the packaging numbers to form a packaging attribute table; mounting the chip component on a feeder disk, binding the packaging number corresponding to the chip component to the disk number of the feeder disk to form a mapping code to form a plurality of feeder disks equipped with chips; in the mounting portion of the feeder disk of a chip mounter, redefining the installation position of the feeder disks according to the shape of the plurality of feeder disks. The method can improve efficiency and achieve high patch mounting accuracy.

Description

technical field [0001] The invention relates to the manufacturing technology of printed circuit boards, in particular to a method for controlling the position of SMT chip components and a system thereof. Background technique [0002] SMT is a surface composition technology, which is a method of mounting non-lead or short-lead surface mount components (SMC) on the surface of a printed circuit board PCB or the surface of other substrates, and then soldering and assembling by flow soldering or dip soldering. circuit connection technology. SMD production and manufacturing execution control system is an important process system in the electronic industry, which can complete the automatic welding of precise SMD electronic components. Its core equipment is various brands of SMT machines, which cooperate with printing machines and various inspections The equipment constitutes a complete production control system. [0003] In the production process of circuit boards, a large number...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K3/34
CPCH05K3/341H05K13/0465
Inventor 姚慧平黄小双
Owner 深圳捷创电子科技有限公司