A kind of lead-free soldering method

Abstract

The invention discloses a lead and lead-free soldering method and belongs to the field of electronic assembly. The method comprises selecting a printed circuit board to make a furnace temperature testboard; when the temperature of a reflow furnace reaches the requirement, placing the furnace temperature test board and a furnace temperature tester in the reflow furnace for furnace temperature test, and obtaining a reflow profile; acquiring reflow profile data according to the reflow profile, and detecting whether the reflow profile meets standard data requirements; if the reflow profile does not meet standard data requirements, adjusting the temperature of a temperature zone corresponding to the reflow profile data; if the reflow profile meets standard data requirements, selecting lead solder paste to print the printed circuit board to be soldered; mounting a device to be soldered on a bonding pad of the printed circuit board to be soldered; and calling a reflow profile corresponding to the reflow profile data that meets the standard data requirements to perform reflow soldering. The problem that welding defects easily occur in current lead-free soldering is solved, and the effectsof ensuring soldering quality and avoiding defects such as pseudo soldering and bubbles at welding spots are achieved.

Description

technical field [0001] The embodiments of the present invention relate to the field of electronic assembly, in particular to a lead-free lead-free soldering method. Background technique [0002] Lead has good flexibility, ductility, low melting point and corrosion resistance, and is widely used in BGA, FC packaging and SMT assembly fields in the electronics industry. However, lead is a toxic metal, and a large amount of use will not only cause serious environmental pollution. It also greatly endangers human health. [0003] As the problem of environmental pollution affecting human health has become the focus of global attention, the electronic packaging industry has begun to change to lead-free. The use of lead-free packaging materials is the development trend of soldering materials and processes in the electronic packaging industry. As a transitional stage, the use of lead-free Soldering lead-free devices with lead solder has become a current research direction. [0004] ...

AI Technical Summary

Problems solved by technology

[0004] However, lead-free soldering has high melting temperature, poor wettability, fast oxidation speed, and prone to soldering defects, such as bridging, virtual soldering, etc., and it is difficult to guarantee the soldering quality and service life of printed circuit boards.

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