Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Lead and lead-free soldering method

A lead-free soldering and surface soldering technology, used in welding equipment, electrical components, printed circuit manufacturing, etc., can solve the problems of high melting temperature, fast oxidation speed and poor wettability of lead-free soldering, so as to ensure the welding quality and avoid The effect of virtual welding

Active Publication Date: 2019-04-26
无锡市同步电子制造有限公司
View PDF9 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, lead-free soldering has high melting temperature, poor wettability, fast oxidation speed, and prone to soldering defects, such as bridging, virtual soldering, etc., and it is difficult to guarantee the soldering quality and service life of printed circuit boards.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lead and lead-free soldering method
  • Lead and lead-free soldering method
  • Lead and lead-free soldering method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0039] Please refer to figure 1 , which shows a flowchart of a lead-free lead-free soldering method provided by an embodiment of the present invention. like figure 1 As shown, the lead-free lead-free soldering method may include the following steps:

[0040] Step 1: Select the PCB.

[0041] The TOP side of the printed circuit board is soldered with lead-free BGA.

[0042] Step 2: Make a furnace temperature test board using a printed circuit board.

[0043] Select 5 temperature-sensing lines, and arrange 4 temperature-sensing lines evenly around the printed circuit board;

[0044] Drill a hole on the printed circuit board, and bury the remaining 1 temperature sensing line to the bottom of the BGA.

[0045] Step 3: When the tempera...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a lead and lead-free soldering method and belongs to the field of electronic assembly. The method comprises selecting a printed circuit board to make a furnace temperature testboard; when the temperature of a reflow furnace reaches the requirement, placing the furnace temperature test board and a furnace temperature tester in the reflow furnace for furnace temperature test, and obtaining a reflow profile; acquiring reflow profile data according to the reflow profile, and detecting whether the reflow profile meets standard data requirements; if the reflow profile does not meet standard data requirements, adjusting the temperature of a temperature zone corresponding to the reflow profile data; if the reflow profile meets standard data requirements, selecting lead solder paste to print the printed circuit board to be soldered; mounting a device to be soldered on a bonding pad of the printed circuit board to be soldered; and calling a reflow profile corresponding to the reflow profile data that meets the standard data requirements to perform reflow soldering. The problem that welding defects easily occur in current lead-free soldering is solved, and the effectsof ensuring soldering quality and avoiding defects such as pseudo soldering and bubbles at welding spots are achieved.

Description

technical field [0001] The embodiments of the present invention relate to the field of electronic assembly, in particular to a lead-free lead-free soldering method. Background technique [0002] Lead has good flexibility, ductility, low melting point and corrosion resistance, and is widely used in BGA, FC packaging and SMT assembly fields in the electronics industry. However, lead is a toxic metal, and a large amount of use will not only cause serious environmental pollution. It also greatly endangers human health. [0003] As the problem of environmental pollution affecting human health has become the focus of global attention, the electronic packaging industry has begun to change to lead-free. The use of lead-free packaging materials is the development trend of soldering materials and processes in the electronic packaging industry. As a transitional stage, the use of lead-free Soldering lead-free devices with lead solder has become a current research direction. [0004] ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34B23K1/008B23K1/20
CPCB23K1/008B23K1/20H05K3/3494H05K2203/163
Inventor 张海星陆文涛应朝晖郭跃彭一汉
Owner 无锡市同步电子制造有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com