High-performance copper bus and preparation technology thereof

A preparation process and technology for copper busbars, which are applied in the field of high-performance copper busbars and their preparation processes, can solve the problems that copper busbars are susceptible to corrosion, affect power supply temperature and power supply safety, etc., and achieve corrosion resistance, good plasticity, and accurate shape. Size and appearance quality, simple and easy-to-control effects

Inactive Publication Date: 2019-05-14
JIANGSU HUAWEI COPPER IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the problems existing in the prior art that copper busbars are easily corroded under overheating conditions and affect the temperature and safety of power supply, the present invention provides a high-performance copper busbar and its preparation process

Method used

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  • High-performance copper bus and preparation technology thereof

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Effect test

Embodiment 1

[0041] A high-performance copper busbar, its constituent elements include copper, titanium, silicon, ytterbium, zirconium, vanadium, niobium, strontium and inevitable impurities; the weight percentages of the constituent elements are as follows: copper 97.47%, titanium 1.2%, silicon 0.5% %, 0.1% of ytterbium, 0.5% of zirconium, 0.12% of vanadium, 0.06% of niobium, 0.02% of strontium, and 0.03% of unavoidable impurities in total.

[0042] A high-performance copper busbar preparation process, comprising the following steps:

[0043] S1: prepare materials, prepare raw materials of copper, titanium, silicon, ytterbium, zirconium, vanadium, niobium and strontium;

[0044] S2: smelting, the prepared raw materials, the raw materials of titanium, silicon, ytterbium, zirconium, vanadium, niobium, strontium are fully stirred and mixed and then added to a high-temperature smelting furnace for smelting;

[0045] Step S2 specifically includes the following steps:

[0046] S21: Preheating...

Embodiment 2

[0062] A high-performance copper busbar, its constituent elements include copper, titanium, silicon, ytterbium, zirconium, vanadium, niobium, strontium and inevitable impurities; the weight percentages of the constituent elements are as follows: copper 95.04%, titanium 2.6%, silicon 0.8% %, 0.3% of ytterbium, 0.9% of zirconium, 0.18% of vanadium, 0.1% of niobium, 0.05% of strontium and 0.03% of the total amount of inevitable impurities.

[0063] A high-performance copper busbar preparation process, comprising the following steps:

[0064] S1: prepare materials, prepare raw materials of copper, titanium, silicon, ytterbium, zirconium, vanadium, niobium and strontium;

[0065] S2: smelting, the prepared raw materials, the raw materials of titanium, silicon, ytterbium, zirconium, vanadium, niobium, strontium are fully stirred and mixed and then added to a high-temperature smelting furnace for smelting;

[0066] Step S2 also includes the following steps:

[0067] S21: Preheating...

Embodiment 3

[0083] A high-performance copper busbar, its constituent elements include copper, titanium, silicon, ytterbium, zirconium, vanadium, niobium, strontium and inevitable impurities; the weight percentages of the constituent elements are as follows: copper 96.21%, titanium 2%, silicon 0.6% %, 0.2% of ytterbium, 0.7% of zirconium, 0.15% of vanadium, 0.08% of niobium, 0.03% of strontium and 0.03% of unavoidable impurities in total.

[0084] A high-performance copper busbar preparation process, comprising the following steps:

[0085] S1: prepare materials, prepare raw materials of copper, titanium, silicon, ytterbium, zirconium, vanadium, niobium and strontium;

[0086] S2: smelting, the prepared raw materials, the raw materials of titanium, silicon, ytterbium, zirconium, vanadium, niobium, strontium are fully stirred and mixed and then added to a high-temperature smelting furnace for smelting;

[0087] Step S2 also includes the following steps:

[0088] S21: The furnace is prehea...

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Abstract

The invention provides a high-performance copper bus and a preparation technology thereof. The high-performance copper bus comprises the following component elements in percentage by weight: 94-99% ofcopper, 1.2-2.6% of titanium, 0.5-0.8% of silicon, 0.1-0.3% of ytterbium, 0.5-0.9% of zirconium, 0.12-0.18% of vanadium, 0.06-0.1% of niobium, 0.02-0.05% of strontium, and not greater than 0.03% of inevitable impurities. The preparation technology comprises the following steps: S1, preparing materials; S2, melting; S3, maintaining the temperature and standing; S4, continuously drawing casting; S5, rossing; S6, pickling; S7, continuously extruding; S8, continuously forging through a die; and S9, treating the surface. According to the technology, the steps of secondary annealing and secondary pickling are carried out, so that the mechanical strength of the copper bus is high; brittle failure caused by excessively high hardness performance is avoided, and the excessively soft problem causedby performance is removed.

Description

technical field [0001] The invention relates to the technical field of copper busbar production, in particular to a high-performance copper busbar and a preparation process thereof. Background technique [0002] Copper busbar, also known as copper busbar or copper busbar, is a long conductor with a rectangular or chamfered (rounded) rectangular cross-section, which plays the role of conveying current and connecting electrical equipment in the circuit. In recent years, the state has increased investment and development in basic industries and independent innovation. The construction of large-scale projects such as large-scale hydropower stations, nuclear power plants, subways, airports, high-speed trains, and high-tech products has also affected the conductive components of various electrical equipment used in project construction. The technical performance of copper busbars, such as conductivity, hardness, toughness, bending, and the safety performance of conductive componen...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C1/02C22F1/02C22F1/08B21C23/00
Inventor 肖康才
Owner JIANGSU HUAWEI COPPER IND
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