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Sensing system, system for monitoring wafer transfer cartridge, and method for monitoring environment thereof

A technology for wafer transfer boxes and sensing systems, applied in the direction of control/regulation systems, measuring devices, conveyor objects, etc.

Active Publication Date: 2019-05-21
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Additionally, wafers can be sensitive to changes in temperature, humidity, and other environmental factors

Method used

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  • Sensing system, system for monitoring wafer transfer cartridge, and method for monitoring environment thereof
  • Sensing system, system for monitoring wafer transfer cartridge, and method for monitoring environment thereof
  • Sensing system, system for monitoring wafer transfer cartridge, and method for monitoring environment thereof

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Embodiment Construction

[0046] The present disclosure relates to monitoring the environment of a FOUP. Although the present disclosure is described in terms of monitoring of FOUPs, it should be understood that any apparatus for transporting or handling vulnerable devices could benefit from the present invention.

[0047] It should be understood that the following disclosure provides many different embodiments, or examples, for implementing different features of the invention. The following disclosure describes specific examples of various components and their arrangements, for simplicity of illustration. Also, this is by way of example only and not intended to be limiting. Some elements are presented in simplified form and inherently include components well known in the art. In addition, the same component numbers and / or words may be used repeatedly in the following different embodiments. These repetitions are for the purpose of simplification and clarity, and are not intended to limit the specific...

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Abstract

The present disclosure provides a sensing system, a system for monitoring a front-open wafer transfer cassette (FOUP), and an environmental method for monitoring the front-open wafer transfer cassette(FOUP). The systems and methods include a FOUP for holding one or more wafers; And one or more environmental sensors disposed among the FOUPs and configured to measure environmental parameters at theFOUPs. The system and method also include a wireless transmitter in communication connection with the environment sensor. A wireless transmitter is disposed within the FOUP and is configured to transmit the environmental parameters measured from the environmental sensor.

Description

technical field [0001] Some embodiments of the present invention relate to a semiconductor wafer processing method and equipment, in particular to a method and equipment for monitoring the environment of a front-opening FOUP. Background technique [0002] The semiconductor integrated circuit industry has gone through a stage of vigorous development. Technological advances in integrated circuit materials and design have produced each generation of integrated circuits that are smaller and more complex in their circuitry than those produced before. In the course of integrated circuit development, functional density (e.g., the number of interconnected devices per wafer area) has generally increased, while geometric size (e.g., the smallest component (or circuit) that can be created in a process) is a general decline. This process of miniaturization often provides many benefits by increasing production efficiency and reducing related expenses. In order to achieve these advanta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67389H01L21/67393H01L21/67259H01L21/67772H01L21/02H01L21/67253G01N25/68G05D22/02G01F1/74G01N25/56G01N25/60
Inventor 林博舜黄志龙郑功杰
Owner TAIWAN SEMICON MFG CO LTD