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Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating

A technology for conductive traces and electrical connections, applied in the field of semiconductor devices, can solve problems such as increased cost and increased complexity

Pending Publication Date: 2019-05-24
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, such interposers add cost, complexity and increase the overall thickness of the design

Method used

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  • Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating
  • Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating
  • Formation of Conductive Connection Tracks in Package Mold Body Using Electroless Plating

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Embodiment Construction

[0020] Embodiments described herein include a method of forming conductive traces in a molded body of a packaged semiconductor device. According to this technique, there is provided a packaged semiconductor device having an electrically insulating molding compound. The molding compound encapsulates at least one semiconductor die and associated electrical connections (eg, wire bonds) between the semiconductor die and the first leads. The conductive traces are formed in an electrically insulating molding compound.

[0021] By forming conductive traces in a molded body of a packaged semiconductor device according to the techniques disclosed in certain embodiments of the present invention, various advantageous space-saving package designs can be achieved. For example, the conductive traces can be used to provide a compact package design whereby two facing circuit assemblies are molded together in a single package. In this package, separate lead frames may be provided on the top ...

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Abstract

The present invention provides a first packaged semiconductor device. The first packaged semiconductor device includes a first semiconductor die having a first terminal, a first electrically conductive lead that is electrically connected to the first terminal, and a first electrically insulating mold compound that encapsulates the first semiconductor die and exposes an end portion of the first lead at an outer surface of the first mold compound. A conductive track is formed in the outer surface of the first mold compound. Forming the conductive track includes activating a portion of the outersurface of the first mold compound for an electroless plating process, and performing the electroless plating process so as to form an electrically conductive material only within the activated portion of the outer surface of the first mold compound.

Description

technical field [0001] The present application relates to semiconductor devices, and in particular to techniques for electrically connecting together one or more than two packaged semiconductor devices. Background technique [0002] Integrated circuit devices, such as semiconductor chips, are typically packaged using lead frames and encapsulation materials such as molding compounds. For example, one or more semiconductor chips may be physically attached and electrically connected to the lead frame, eg, using conductive bonding wires. An encapsulation material is formed around the semiconductor chip and the electrical connection structures. Encapsulation materials protect semiconductor chips and electrical connections from environmental conditions such as moisture, temperature, foreign particles, and the like. The leads of the lead frame are accessible from the outside of the encapsulation material, and in some cases protrude from the encapsulation material. These outer po...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/48H01L23/49H01L23/31
CPCH01L2924/181H01L2224/05553H01L2224/05554H01L2224/48091H01L2224/48247H01L23/49537H01L23/49575H01L23/3121H01L25/50H01L2924/00012H01L2924/00014H01L23/3107H01L23/482H01L21/76874H01L23/528H01L23/564
Inventor C·H·丹尼许N·莫尔班Y·C·傅K·C·苏S·H·文森特杨
Owner INFINEON TECH AG
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