A kind of chip under test and test system

Abstract

The invention discloses a chip to be tested and a test system, wherein the chip to be tested includes a function pin to be tested, a special test pin, a data reading register and a data writing register; wherein, the data reading register and the function to be tested The pins are connected in one-to-one correspondence to read the signal status of the connected functional pins to be tested, and the data write register is connected to the dedicated test pins in a one-to-one correspondence to write the signal status into the connected test dedicated pins. Any data writing register is connected with at most one data reading register at the same time, so that the oscilloscope can read the signal state of the function pin under test connected to the special testing pin through the corresponding special testing pin. This application only needs to read the signal state of the function pin to be tested to achieve signal measurement, and will not lead out the signal of the function pin to be tested, so there is no signal bifurcation caused by the signal of the function pin to be tested. Thus affecting the signal quality problem.

Description

technical field [0001] The invention relates to the technical field of chip testing, and more specifically, to a chip to be tested and a testing system. Background technique [0002] In the debugging stage of the server, in order to verify the system function of the server and locate the cause of the failure, it is often necessary to test the waveform of the digital signal, and these digital signals are generally derived from the service chip of the server. [0003] Currently, there are two main methods for testing digital signal waveforms: the first one is to manually use an oscilloscope probe to touch the chip under test (the chip under test is the chip under test that needs to realize the signal measurement) on the board that corresponds to the digital signal that needs to be detected. The exposed conductor parts (measuring points) such as via holes, pads, pins, etc. are used to measure the waveform of digital signals. This method is difficult to operate. If the operation...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a chip to be tested and a test system, which can solve the problem of signal bifurcation caused by signal extraction and thus affect signal quality in the technical solution for realizing the corresponding signal measurement of the chip to be tested in the prior art

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