A BGA-packaged test socket that is convenient for taking and unloading materials
A technology for picking and placing materials and test sockets, which is applied in the direction of measuring devices, measuring electrical variables, measuring device shells, etc., can solve the problems of inconvenient picking and placing of BGA packaging, and achieve the effects of stable testing, high production efficiency, and convenient packaging
Inactive Publication Date: 2021-03-05
何华辉
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Problems solved by technology
[0004] The purpose of the present invention is to solve the technical problem that it is inconvenient for existing equipment operators to take and place BGA packaging, and to provide a test socket for BGA packaging that is convenient for taking and placing materials.
Method used
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Embodiment Construction
[0016] like figure 1 , figure 2 As shown, a test seat for BGA packaging that is convenient for taking and unloading materials includes a cuboid support base 10 and a test pick-and-discharge device 20; The center of the end surface is formed with a rectangular groove-shaped lower limit groove 102; the upper ends of the left and right side walls of the upper limit groove 100 are respectively formed with a swing avoidance groove 101; the test taking and discharging device 20 includes a probe support plate 24, a pair of side support plates 22 and A pair of swinging cover plates 23; the probe support plate 24 is elastically lifted and arranged in the lower limit groove 102; the upper end surface of the probe support plate 24 is formed with a number of probes 25; the probes 25 pass through the upper limit vertically from bottom to top The lower side wall of the groove 100; when the probe support plate 24 is at the uppermost end, the upper end of the probe 25 exceeds the lower side...
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The invention discloses a BGA-encapsulated test seat which is convenient for taking and unloading materials. The probe support plate is elastically raised and lowered in the lower limit groove; the upper end surface of the probe support plate is formed with several probes; the probes vertically pass through the upper limit The lower side wall of the position slot; a pair of side support plates are synchronously lifted and lowered and set in the upper limit slot; the ends close to the upper end surfaces of the pair of side support plates are respectively formed with limited positioning grooves; the upper end surfaces of the pair of side support plates are far away from each other. A pair of swing support plates arranged symmetrically front and back are formed; cylindrical swing guide rods arranged in the front and rear directions are formed between the swing support plates; a swing center rod is formed at the lower end of the swing cover plate; the swing center rod is pivotally connected to the corresponding side of the swing The lower end of the front and rear side walls of the avoidance groove; the swing cover plate is formed with a long-hole-shaped sliding guide groove that runs through the front and rear; The invention makes it convenient for operators to take and place BGA packages, has high production efficiency and stable testing.
Description
technical field [0001] The invention relates to the field of integrated circuit packaging and testing, in particular to a test seat for BGA packaging which is convenient for picking and unloading materials. Background technique [0002] Semiconductor components are processed into semiconductor chip packages through a series of packaging projects, such as BGA packages. The processed semiconductor chip packages must go through electrical inspection projects before being provided to users; electrical characteristics. Here, the test socket is a device that electrically connects the direct loop of each semiconductor component to the test instrument. [0003] During the test, the operator places the BGA package in the inspection slot, then checks the side wall, and finally takes out the BGA package from the inspection slot. Since the gap between the package and the side wall of the inspection slot is limited, the operator takes and places the BGA Packaging is not very convenient...
Claims
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IPC IPC(8): G01R1/04
CPCG01R1/0408
Inventor 何华辉
Owner 何华辉