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Heat dissipating device, heat exchange circulation system and electrical device

A heat dissipation device and circulation system technology, which is applied in the field of heat exchange circulation system, electrical equipment, and heat dissipation device, can solve the problems of loss of cooling capacity of refrigeration medium, reduction of subcooling degree of refrigeration medium, increase of pressure drop, etc., to ensure the cooling effect , Effective cooling effect

Pending Publication Date: 2019-08-20
GREE ELECTRIC APPLIANCES INC
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, there is a problem that: due to the use of cooling medium for heat dissipation, the supercooled cooling medium absorbs the heat of the heat dissipation elements in the controller, causing loss of the cooling capacity of the cooling medium, resulting in the overcooling of the cooling medium in the air-conditioning refrigeration cycle system. The coldness decreases and the pressure drop increases at the same time, which adversely affects the cooling capacity of the air conditioner

Method used

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  • Heat dissipating device, heat exchange circulation system and electrical device
  • Heat dissipating device, heat exchange circulation system and electrical device
  • Heat dissipating device, heat exchange circulation system and electrical device

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Embodiment Construction

[0047] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be described in detail below. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in the present application, all other implementation manners obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

[0048] figure 1 It is a schematic diagram of the overall structure of a heat dissipation device provided by an embodiment of the present application, figure 2 A structural schematic diagram of the relationship between the first refrigerant medium channel, the second refrigerant medium channel and the heat dissipation elements provided for an embodiment of the present application, as shown in figure 1 and figure 2 As shown, the cooling device 101 includes:

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Abstract

The invention relates to a heat dissipating device, a heat exchange circulation system and an electrical device, and belongs to the technical field of heat dissipation. The heat dissipating device comprises a first refrigerating medium passage and a second refrigerating medium passage; the first refrigerating medium passage is used for conveying a first refrigerating medium and transferring heat of at least one element required to dissipate heat into the first refrigerating medium, and the first refrigerating medium is a refrigerant for heat exchange circulation; the second refrigerating medium passage is used for conveying a second refrigerating medium, and the temperature of the second refrigerating medium entering the second refrigerating medium passage is lower than the temperature ofthe first refrigerating medium entering the first refrigerating medium passage; and the first refrigerating medium passage and the second refrigerating medium passage are configured to enable heat exchange to be carried out between the first refrigerating medium and the second refrigerating medium. The heat dissipating device contributes to the double needs of satisfying effective heat dissipationof the elements and ensuring the refrigerating effect when the refrigerant for heat exchange circulation is used for refrigerating.

Description

technical field [0001] The application belongs to the technical field of heat dissipation, and in particular relates to a heat dissipation device, a heat exchange cycle system and electrical equipment. Background technique [0002] In air-conditioning equipment, the controller is an important part. In the controller, there are some high-power components, such as: IPM (Intelligent Power Module), PFC (Power Factor Correction) and other components. When the controller is working, these Components with high power levels generate a lot of heat, which accumulates in the controller, which will affect the overall performance of the controller and further affect the reliability of the controller. [0003] Therefore, the heat treatment scheme of high-power components has become a thorny problem for controller designers and structural designers. In the related art, combined with the refrigeration system of the air conditioner, the performance and reliability of the controller can be g...

Claims

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Application Information

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IPC IPC(8): F24F11/89F24F13/22H05K7/20
CPCF24F11/89F24F13/222H05K7/20
Inventor 刘为爽李志强彭斌杨秋石张永炜潘卫琼赵京龙闫志斌
Owner GREE ELECTRIC APPLIANCES INC