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Method for assembling radiating fins of radiator

A heat dissipation fin and assembly method technology, applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., can solve the problems that the finished product is difficult to meet the high heat conduction of the radiator, increase the conduction thermal resistance, and avoid easy loosening The effect of detachment and connection

Inactive Publication Date: 2019-08-20
鑫佰图科技(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the heat sink is usually welded to the heat sink base by welding. However, after the welding process, the welding surface between the heat sink fins and the heat sink base will increase the conduction thermal resistance, making it difficult for the finished product to conform to The need for high thermal conductivity of heat sinks

Method used

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  • Method for assembling radiating fins of radiator
  • Method for assembling radiating fins of radiator

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Embodiment Construction

[0020] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings of the embodiments of the present invention, and the present invention is not limited to the following specific embodiments.

[0021] It should be understood that the same or similar symbols in the drawings of the embodiments correspond to the same or similar components. In describing the present invention, it is to be understood that if the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom" etc. indicate an orientation Or the positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that...

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Abstract

The invention discloses a method for assembling radiating fins of a radiator. The method for assembling radiating fins of a radiator comprises the following steps of: providing a radiating fin and a radiating base, one end of the radiating fin is a connection end, the connection end is provided with a reverse folding part, the radiating base is provided with a plurality of matching grooves, and the matching grooves are used to correspondingly insert and connect with the radiating fin; the connection end of the radiating fin is inserted into the matching grooves, the action force in the direction of the bottoms of the matching grooves is applied to the reverse folding part through external pressure, the reverse folding part deforms and expands under the action of the external pressure, andthe connection end and the reverse folding part are pressed and abutted against the internal portions of the matching grooves. The pressing assembling is performed in a stamping mode, the reverse folding part is arranged at the connection end, the reverse folding part is stamped to increase the deformation so that the reverse folding part is compressed in the matching grooves, and connection of the radiating fin and the radiating base is more film, and the requirement of high heat conduction of the radiator is met.

Description

technical field [0001] The invention relates to a method for assembling heat dissipation fins of a radiator. Background technique [0002] Usually, the heat sink includes a heat dissipation base and a plurality of heat dissipation fins arranged on the heat dissipation base. The heat sink is arranged on the electronic component to be dissipated. The dissipation of heat energy is realized specifically through the large surface area of ​​a plurality of heat dissipation fins, the larger the surface area, the better the heat dissipation effect. In the prior art, the heat sink is usually welded to the heat sink base by welding. However, after the welding process, the welding surface between the heat sink fins and the heat sink base will increase the conduction thermal resistance, making it difficult for the finished product to conform to Heat sink needs high thermal conductivity. Contents of the invention [0003] The purpose of the present invention is to overcome the deficie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 张文前刘洪兵姚福仁
Owner 鑫佰图科技(惠州)有限公司