Method for manufacturing heat conducting substrate
A production method and technology for thermally conductive substrates, which are applied in circuit thermal devices, printed circuit manufacturing, printed circuit components, etc., can solve the problems of complicated circuit board processes, affecting the quality of electronic products, and difficult circuit board processing.
Inactive Publication Date: 2015-11-25
LIGHTEN
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Problems solved by technology
[0004] At present, the process of circuit boards is complicated and requires various processing techniques. If a thinner substrate is directly used for circuit board processing in order to meet the needs of thinning, it may be difficult to process due to the thickness of the circuit board during the processing process. , which reduces the yield rate of the circuit board, which in turn affects the quality of electronic products
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[0031] The detailed description is as follows, and the preferred embodiment is only for illustration and not intended to limit the present invention.
[0032] see Figure 1a to Figure 1d Shown is a schematic structural diagram of a method for manufacturing a thermally conductive substrate according to a first embodiment of the present invention. Such as Figure 1a As shown, a metal plate 10 is provided, with a first surface 12 and a second surface 14 opposite, and a plurality of micro-bumps 16 are formed on the first surface 12; then, as Figure 1b As shown, an adhesive layer 18 is coated on the first surface 12 without forming micro-bumps 16, so that the adhesive layer 18 is interposed between the micro-bumps 16. In one embodiment, the thickness of the adhesive layer 18 is slightly lower At the height of the micro-bump 16; after that, as Figure 1c As shown, a circuit layer 20 is provided, and a plurality of first openings 22 are formed on the circuit layer 20, and the posi...
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A method for manufacturing a heat conducting substrate includes providing a metal plate with a first surface and an opposed second surface; forming a plurality of micro bumps on the first surface; disposing an adhesive layer on the first surface among the micro bumps; providing a circuit layer with a plurality of first openings formed thereon, positions of the first openings corresponding to positions of the micro bumps; fixing the circuit layer onto the adhesive layer, wherein the micro bumps are exposed through the first openings respectively; manufacturing circuits on the circuit layer; and finally, thinning a thickness of the metal plate. The method for manufacturing a heat conducting substrate has the manufactured heat conducting substrate to meet the requirements of being thin-shaped and having high heat conducting electronic elements, and has the advantage of an improved yield.
Description
technical field [0001] The invention relates to a thermally conductive substrate, in particular to a method for manufacturing a highly thermally conductive and thinned thermally conductive substrate. Background technique [0002] In portable electronic products, the thinning and light weight are the current consumers' pursuit. However, due to the increasingly powerful functions expected from portable electronic products in the market, the functional electronic components contained in them It also needs to be relatively increased. As the command cycle of electronic components becomes faster and the number of I / Os increases, electronic components also generate considerable heat during operation. The heat accumulated on electronic components will cause damage to electronic components, resulting in The life and reliability of electronic components are reduced. [0003] At present, circuit boards are used in a wide range of levels and fields. Generally, electronic components in ...
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IPC IPC(8): H05K1/02
CPCH05K1/0204H05K1/056H05K2201/09054H05K2201/10416H05K2203/0353H05K3/0061
Inventor 杨政道
Owner LIGHTEN