Electromagnetic shielding cover

A technology of electromagnetic shielding cover and conductive tape, which is applied in the fields of magnetic field/electric field shielding, electrical components, substation/switch layout details, etc. The relative area increases, etc., to achieve good ventilation and heat dissipation, increase design flexibility, and reduce sensitivity.

Active Publication Date: 2019-09-17
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] 1) The frequency-selective surface structure without special design is sensitive to the angle of incidence and polarization mode, and has good shielding performance only under certain specific angles of incidence and polarization mode, which is not suitable for practical engineering applications;
[0009] 2) Miniaturization is a common technique to improve the stability of the incident angle and polarization mode of the frequency selective surface, but the miniaturization will lead to an increase in the relative area of ​​the metal layer, so it is not suitable in the case of opening a heat dissipation hole, which is also As a result, the existing work rarely studies the open-hole heat dissipation frequency selective surface;
[0010] 3) When electromagnetic waves are incident in different polarization modes and angles, it is difficult to achieve higher shielding effectiveness in a larger bandwidth

Method used

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  • Electromagnetic shielding cover
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0054] figure 1 , figure 2 with image 3 A unit structure of the electromagnetic shielding cover of this example is shown, which is a square structural unit with a side length a, wherein the conductive strip 1 is formed by etching the metal layer on the dielectric substrate 2 . The entire electromagnetic shield is composed of periodic arrangements of this structural unit, such as Figure 4 As shown, the shortest distance between conductive strips 1 in the figure is d.

[0055] Depend on Figure 4 , can also be regarded as the structure of conductive strips 1 periodically distributed on the dielectric substrate.

[0056] In this example, the electromagnetic shielding cover is composed of a dielectric substrate 2 and circular conductive strips 1 that are attached to both sides of the dielectric substrate, have the same structural shape and are aligned with each other, as shown in figure 1 with image 3 shown.

[0057] In this example, the conductive strip 1 has a slotted...

Embodiment 2

[0063] see Figure 7 with Figure 8 The difference between the electromagnetic shielding cover of this example and Embodiment 1 is that in the structural unit of the electromagnetic shielding cover of this example, the shape of the conductive strip 1 is a regular hexagon, which belongs to a linear conductive strip, and the slotted structure of the conductive strip 1 is 10 is also linear, such as Figure 7 with Figure 8 shown.

[0064] For other structures of the electromagnetic shielding cover in this example, reference may be made to the description of Embodiment 1, which will not be repeated here.

[0065] In this example, the conductive strips of the electromagnetic shielding cover can adopt a densely distributed structure, which is beneficial to increase the area of ​​the through hole, such as Figure 8 shown. In the area surrounded by the conductive strips, the through holes 20 can adopt corresponding regular hexagonal through holes, and the ratio of the area of ​​t...

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Abstract

The invention relates to an electromagnetic shielding technology. The invention discloses an electromagnetic shielding cover which comprises a dielectric substrate and conductive bands attached to the two faces of the dielectric substrate. Each conductive band is provided with a slotted structure, and through holes are formed in the dielectric substrate in the areas defined by the conductive bands. The conductive bands are divided into n sections, each section of the conductive band is provided with a closed loop, and gaps exist between the conductive bands, wherein n is an integer, and n >= 2. The beneficial effects of the invention are that the double-layer conductive bands and the slotted structure are adopted, so the electromagnetic wave shielding effect is improved, and when electromagnetic waves are emitted in different polarization modes and angles, quite high shielding efficiency can be achieved in a large bandwidth. The working frequency of the structure can be adjusted to a certain extent by segmenting the conductive bands and adjusting the size of medium holes, and the design flexibility is improved. In addition, through the medium holes, the structure is enabled to have good ventilation and heat dissipation effects. The cover is particularly suitable for shielding requirements of 5G communication related equipment, thereby facilitating improvement of equipment performance.

Description

technical field [0001] The present invention relates to electromagnetic compatibility technology, in particular to electromagnetic shielding technology, in particular to an electromagnetic shielding cover which adopts frequency selective surface technology and has the function of ventilation and heat dissipation. Background technique [0002] Electromagnetic shielding technology is of great significance to improve the electromagnetic compatibility of electronic equipment. The electromagnetic shielding layer is an important means to prevent external electromagnetic waves from interfering with electronic equipment and to prevent the electronic equipment itself from generating electromagnetic radiation. [0003] Due to the complex internal structure of electronic equipment, electromagnetic waves will be reflected differently during propagation, and the electromagnetic shielding layer (cover) needs to have good shielding properties for electromagnetic waves incident in different...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00
CPCH05K9/0007H02B1/565
Inventor 闫丽萍许留留赵翔
Owner SICHUAN UNIV
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