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Taking and putting device

A pick-and-place device and body technology, applied in clamping/extracting devices, transportation and packaging, support structure installation, etc., can solve problems such as insufficient flexibility of circuit boards

Inactive Publication Date: 2019-09-27
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention is to provide a pick-and-place device to solve the problem of insufficient flexibility of using the pick-and-place device to pick and place circuit boards

Method used

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  • Taking and putting device

Examples

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Embodiment Construction

[0071] The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient to enable any person familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of the patent application and the drawings , anyone skilled in the relevant art can easily understand the related objects and advantages of the present invention. The following examples further illustrate the concept of the present invention in detail, but do not limit the scope of the present invention in any way.

[0072] see figure 1 . figure 1 It is a perspective view of a circuit board and a pick-and-place device according to an embodiment of the present invention.

[0073] The pick-and-place device 10 of this embodiment is used to pick and place a circuit board 20 , and includes a base 100 , a conveying mec...

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Abstract

The invention provides a taking and putting device. The device is suitable for a circuit board and comprises a base, a conveying mechanism, a movable mechanism and a clamping mechanism. The conveying mechanism comprises a first side, a second side, two conveying assemblies and two first driving assemblies. The first side is arranged on the base, the second side is opposite to the first side, the conveying assemblies are arranged on the first side and the second side and are used for conveying the circuit board, the two first driving assemblies are connected to the two conveying assemblies, the movable mechanism is arranged on the base, the clamping mechanism comprises a body, a clamping module and a second driving assembly, the body is movably arranged on the base through the movable mechanism, a first clamping jaw and a second clamping jaw of the clamping module are used for clamping the circuit board, and the second driving assembly is arranged on the body and is connected to the clamping module and enables the first clamping jaw and the second clamping jaw to get close to or away from each other.

Description

technical field [0001] The invention relates to a pick-and-place device, in particular to a pick-and-place device for picking and placing circuit boards. Background technique [0002] Generally speaking, a pick-and-place device for picking and placing circuit boards includes a conveying mechanism and a vacuum chuck, wherein the conveying mechanism is used for conveying the circuit board, and the vacuum chuck is used for picking up the circuit board on the conveying mechanism. [0003] However, since the suction area and suction position of the vacuum chuck when picking up the circuit board will affect the stability of the vacuum chuck to pick up the circuit board, so the circuit boards of different sizes need to be sucked by different vacuum chucks, so as to prevent the circuit board from being sucked during the suction process. fall off. In addition, since the vacuum chuck needs to be adsorbed to the central area of ​​the circuit board to stably absorb the circuit board, i...

Claims

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Application Information

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IPC IPC(8): B65G15/20B65G21/00B65G47/90
CPCB65G15/20B65G21/00B65G47/902H05K13/0061B65G15/12B65G47/91H05K7/1402H05K13/0406H05K13/0413
Inventor 陈柏瑞刘庆源
Owner INVENTEC PUDONG TECH CORPOARTION
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