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Sensor device and manufacturing method thereof

A support, micro-electro-mechanical system technology, applied in the direction of sensors, microphones, electrostatic transducer microphones, etc., can solve problems that are not completely satisfactory

Active Publication Date: 2021-12-14
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although existing devices and methods for forming MEMS devices are generally adequate for their intended purposes, they are not entirely satisfactory in all respects

Method used

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  • Sensor device and manufacturing method thereof
  • Sensor device and manufacturing method thereof
  • Sensor device and manufacturing method thereof

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Embodiment Construction

[0080] It should be understood that the following disclosure provides many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, the dimensions of the elements are not limited to the disclosed ranges or values, but may depend on process conditions and / or desired properties of the device. In addition, in the following description, forming the first part over or on the second part may include an embodiment in which the first part and the second part are formed in direct contact, and may also include an embodiment in which the first part and the second part are formed. An embodiment in which an additional component may be formed between such that the first component and the second component may not be in direct contact. Various features may be arbitr...

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Abstract

A microelectromechanical system (MEMS) microphone includes a first membrane, a second membrane, a third membrane disposed between the first membrane and the second membrane, a membrane disposed between the first membrane and the third membrane and surrounded by a first wall a first cavity, a second cavity disposed between the second membrane and the third membrane and surrounded by the second wall, and one or more first supports are disposed in the first cavity and connect the first membrane and the third membrane third film. Embodiments of the present invention relate to sensor devices and manufacturing methods thereof.

Description

technical field [0001] Embodiments of the present invention relate to sensor devices and manufacturing methods thereof. Background technique [0002] More recently, microelectromechanical systems (MEMS) devices have been developed. MEMS devices include devices fabricated using semiconductor technology to form mechanical and electrical components. MEMS devices are implemented in pressure sensors, microphones, actuators, mirrors, heaters and / or printer nozzles. While existing devices and methods for forming MEMS devices are generally adequate for their intended purposes, they are not entirely satisfactory in all respects. Contents of the invention [0003] According to some embodiments of the present invention, there is provided a microelectromechanical system (MEMS) microphone, comprising: a first film; a second film; a third film, disposed between the first film and the second film; a first cavity, disposed between the first film and the third film, and surrounded by a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R31/00H04R2231/001B81B2203/0127B81B2201/0257B81B3/007H04R19/005H04R7/10H04R31/003B81C1/00658H04R7/06H04R2201/003B81B2203/0361B81B2203/0315B81C2201/0133
Inventor 杨辰雄郑钧文朱家骅陈恩湛
Owner TAIWAN SEMICON MFG CO LTD