Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Solder-resisting printing method applied solder mask holes in finished PCB in copper thickness of 2OZ to 3OZ

A printing method and green oil technology, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problems of insufficient ink thickness, high cost, thick ink thickness on large copper surfaces, etc. The effect of reducing the amount of ink entering the hole

Active Publication Date: 2019-10-25
高德(江苏)电子科技股份有限公司
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, to provide a solder resist printing method for green oil hole of PCB products with a copper thickness of 2OZ to 3OZ, to solve the problem of green oil hole plugging of PCB products of 2OZ to 3OZ, Changed the problem of insufficient ink thickness for one-time printing and "conventional" two-time printing; high cost for two times of solder masking process, thicker ink thickness on large copper surface, and at the same time ensured that the ink thickness on the copper surface is between 0.4mil~2mil requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A solder resist printing method applied to PCB finished products with a copper thickness of 2OZ to 3OZ. PCB boards with a thickness of 2OZ to 3OZ can reach the ink thickness of 0.4mil-2.0mil on the copper surface, and meet the requirements of white light through the green oil hole. It is possible to process this kind of PCB products with a solder mask process, which specifically includes the following steps:

[0020] (1) Confirm that the finished copper thickness of the PCB board is 2OZ-3OZ, and the board has a green oil hole design, and requires that the green oil hole does not allow ink to block the hole and needs to be transparent. The thickness of the ink on the copper on the large copper surface is 0.4mil- 2.0mil;

[0021] (2) Confirm the solder resist printing ink required for the board, and adjust the viscosity of the solder resist printing ink to 60dps~100dps;

[0022] (3) Confirm the position of the green oil hole that is not plugged on the PCB board;

[0023...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a solder-resisting printing method applied solder mask holes in finished PCB in the copper thickness of 2OZ to 3OZ, and belongs to the technical field of PCB production. The method comprises the following steps that product information is confirmed before printing, a solder-resist printing screen material is made, a printing screen is made, and a product is printed. The problem that the solder-resisting ink in corners is not sufficiently thick by once printing but the cost is high by twice printing in the primary solder-resisting flow is solved; in the finished PCB in the copper thickness of 2OZ to 3OZ, the ink thickness of the copper surface is 0.4mil to 2.0mil, the solder mask holes can transmit white light, and it is possible that such PCB product uses only oncesolder-resisting; and the design method are suitable for all types of solder mask holes in the copper thickness of 2OZ to 3OZ in finished products.

Description

technical field [0001] The invention belongs to the technical field of PCB board production, and in particular relates to a solder-proof printing method for green oil holes applied to finished PCBs with a copper thickness of 2OZ to 3OZ. Background technique [0002] With the rapid development of electronic products, many special products correspond to special needs. Traditional circuit board design is difficult to meet some special needs. To ensure product performance and product life and stability, a large number of heat dissipation components will be designed. Such heat dissipation components are inserted into the holes of the first type of holes. The heat of the PCB (printed circuit board) and heat dissipation components is conducted to each other, and the heat is ventilated and dissipated. In order to ensure the heat dissipation effect of the product, the copper thickness of the PCB is generally designed to be between 2OZ and 3OZ; at the same time, in order to ensure th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/28
CPCH05K3/0094H05K3/282H05K2201/0959
Inventor 崔居民
Owner 高德(江苏)电子科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com