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Process for improving ink in high aspect ratio Via hole

A high aspect ratio, ink technology, used in printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of ink color limitation, reduce the development line speed, increase the development pressure, etc., to improve the poor ink, simple operation, The effect of simple process

Active Publication Date: 2020-07-31
高德(江苏)电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the advancement and development of industrial technology, customers have higher and higher requirements for products. Customers clearly require that the via hole should not have ink in the hole. In order to solve the problem of ink in the via hole with high aspect ratio, the industry firstly reduces the development speed. Increase the developing pressure, but there are certain risks in these improvement measures, which will cause the ink to fall off; the second is to use electrostatic spraying and air pressure spraying equipment, but the thickness of the ink produced by these equipment is thicker than that of screen printing ink, which is not suitable for consumer electronics products , and limited by ink color

Method used

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  • Process for improving ink in high aspect ratio Via hole

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A process for improving the ink in Via holes with high aspect ratio, the minimum aperture of Via holes is 0.2mm, and the plate thickness is 1.6mm, including the following process steps:

[0023] a. Block design on the screen: the solder mask printing stop is 5mil larger than the Via hole unilaterally (through experimental verification, more than 5mil printing stop will produce SCUM) design, and avoid the solder mask exposure window 3mil safety distance, which is insufficient Cut the solder mask printing stop, such as figure 2 As shown, the aperture of Via hole 1 is 0.2 mm, and the radius of solder mask printing stop 2 is 5 mil larger than that of Via hole 1. At this time, the distance between solder mask printing stop 2 and the short side of solder mask exposure window 3, that is, the left and right is less than 3mil, the two sides of the solder mask printing stop 2 are cut inward to form irregular solder mask printing stop 2 that protrudes up and down;

[0024] b. Sc...

Embodiment 2

[0029] A process for improving the ink in Via holes with high aspect ratio, the minimum aperture of Via holes is 0.2mm, and the plate thickness is 1.8mm, including the following process steps:

[0030] a. Block design on the screen: the solder mask printed stop is designed to be 4.5mil larger than the one side of the Via hole, and the window is 2.5mil safe to avoid solder mask exposure, and the solder mask printed stop is cut off if it is insufficient;

[0031] b. Screen production: select 110-mesh screen;

[0032] c. Anti-soldering pre-treatment: After the pre-treatment ultrasonic washing section, the vibration frequency is controlled at 25Hz to ensure that there is no foreign matter in the hole with a diameter of less than or equal to 0.25mm, and the line speed is 2.5m / min;

[0033] d. Solder resist printing: the printing squeegee and the ink knife are splayed, the printing speed is controlled at 3 / min, the angle of the printing squeegee is controlled at 10°, and the pressur...

Embodiment 3

[0036] A process for improving the ink in Via holes with high aspect ratio, the minimum aperture of Via holes is 0.2mm, and the plate thickness is 2.0mm, including the following process steps:

[0037] a. Block design on the screen: the solder mask printing stop is designed to be 4mil larger than the one side of the Via hole, and the window is 3.5mil safe to avoid solder mask exposure, and the printing stop is cut off if it is insufficient;

[0038] b. Screen production: choose a 90-mesh screen, and its theoretical upper and lower ink volume is 56 cm 2 / m 2 , can meet the ink thickness required by the product, and the wire diameter is 80um at the same time. The irregular solder mask printing stop has no floating area on the screen, and the irregular solder mask printing stop does not fall off;

[0039] c. Pre-treatment for anti-soldering: Washing after the pre-treatment ultrasonic washing section, the vibration frequency is controlled at 26Hz, to ensure that there is no forei...

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PUM

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Abstract

The invention belongs to the technical field of circuit board manufacturing, and discloses a process for improving ink in a high aspect ratio Via hole, which comprises the following steps: designing ablocking point on a screen printing plate, manufacturing the screen printing plate, carrying out solder mask pretreatment, carrying out solder mask exposure, and carrying out solder mask development.The process is simple to operate and simple in process; the solder mask printing blocking points on the screen printing plate can be changed at will according to patterns on a printed product and aredesigned into irregular blocking points, poor ink in holes is improved by reducing the amount of ink entering the holes in the silk-screen printing process, and scrapping and reworking of the ink inthe Via holes with the high aspect ratio are greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a process for improving ink in holes with high aspect ratio Via holes (the ratio of plate thickness to hole diameter is not less than 8). Background technique [0002] With the advancement and development of industrial technology, customers have higher and higher requirements for products. Customers clearly require that the via hole should not have ink in the hole. In order to solve the problem of ink in the via hole with high aspect ratio, the industry firstly reduces the development speed. Increase the developing pressure, but there are certain risks in these improvement measures, which will cause the ink to fall off; the second is to use electrostatic spraying and air pressure spraying equipment, but the thickness of the ink produced by these equipment is thicker than that of screen printing ink, which is not suitable for consumer electronics pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 葛振国
Owner 高德(江苏)电子科技股份有限公司
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