A solder resist printing method for green oil holes with a copper thickness of 2oz to 3oz in pcb products

A technology of PCB board and green oil, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of insufficient ink thickness, high cost, thick ink thickness on large copper surfaces, etc., to reduce the amount of ink entering holes, reduce The effect of the number of small net editions

Active Publication Date: 2022-06-10
高德(江苏)电子科技股份有限公司
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Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, to provide a solder resist printing method for green oil hole of PCB products with a copper thickness of 2OZ to 3OZ, to solve the problem of green oil hole plugging of PCB products of 2OZ to 3OZ, Changed the problem of insufficient ink thickness for one-time printing and "conventional" two-time printing; high cost for two times of solder masking process, thicker ink thickness on large copper surface, and at the same time ensured that the ink thickness on the copper surface is between 0.4mil~2mil requirements

Method used

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Embodiment 1

[0019] A kind of printing method applied to PCB finished copper thickness 2OZ to 3OZ green oil hole, which solves the problem of insufficient copper primary printing corner soldering ink thickness and high cost of the two-time soldering process in the primary welding process; So that the finished copper thickness of 2OZ to 3OZ PCB board, to achieve the copper ink thickness of 0.4mil-2.0mil capacity, to meet the requirements of green oil hole white light, for such PCB products using a solder mask processing is possible, including the following steps:

[0020] (1) Confirm that the finished copper thickness of the PCB plate is 2OZ-3OZ, the plate has a green oil hole design, and requires the green oil hole not to allow the ink to block the hole and needs to transmit white light, and the ink thickness on the large copper surface copper is 0.4mil-2.0mil;

[0021] (2) Confirm the solder-proof printing ink required for the board, and adjust the ink viscosity of the solder-proof printing t...

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Abstract

The invention belongs to the technical field of PCB board production, and discloses a solder-proof printing method for green oil holes with a copper thickness of 2OZ to 3OZ in PCB products, including the following steps: confirming product information before printing, formulating solder-proof printing screen data, printing screen Edition production and printing of products. The invention solves the situation that the thickness of the solder resist ink for printing corners is insufficient in one solder resist process, and the cost of the two solder resist processes is high; the PCB board with a finished copper thickness of 2OZ to 3OZ can reach the ink thickness of 0.4mil-2.0mil on the copper surface Ability to meet the requirements of white light through the green oil hole, it is possible for this type of PCB product to be processed by a solder mask process; this design method is applicable to all finished copper thick 2OZ to 3OZ green oil holes.

Description

Technical field [0001] The present invention belongs to the field of PCB board production technology, specifically relates to a pcB finished copper thickness 2OZ to 3OZ green oil hole solder mask printing method. Background [0002] With the rapid development of electronic products, many special products corresponding to the need for special needs, the traditional circuit board design is difficult to meet some special needs, such as: PCBA (PCB empty board through SMT upper part or DIP plug-in) on-line technology, in order to ensure product performance and product life and stability, will design a large number of heat dissipation components, such cooling components inserted in a class of holes in the hole, heat dissipation components and hole walls completely combined together, It helps the heat of PCB (printed circuit board) and heat dissipation components to conduct each other, and it is breathable and heat dissipated. In order to ensure the heat dissipation effect of the produc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/28
CPCH05K3/0094H05K3/282H05K2201/0959
Inventor 崔居民
Owner 高德(江苏)电子科技股份有限公司
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