Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of precision pcb blank board and its processing molding method

A technology for processing molding and blanks, which is applied to the positioning of circuit board tools, printed circuits, printed circuit components, etc., can solve problems such as sharp corners of pcb boards, and achieve the effect of convenient fixing and ensuring the accuracy of external dimensions

Active Publication Date: 2021-10-26
信丰迅捷兴电路科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the defects of the prior art, the technical problem to be solved by the present invention is to propose a precision PCB blank board and its processing and forming method, which can control the shape efficiently, in batches, and with high precision when there are no positioning holes in the board Dimensional tolerance, improving dimensional accuracy deviation and PCB board sharp corners, burrs and edge unevenness

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of precision pcb blank board and its processing molding method
  • A kind of precision pcb blank board and its processing molding method

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0021] like figure 1 As shown, a precision PCB blank board provided in this embodiment includes a blank board body 1, the middle part of the board body is a forming area 11, and the board body is provided with two first-stage Positioning holes 3; three sides of the plate body are provided with secondary positioning holes 4, the secondary positioning holes 4 are located outside the forming area 11, the connection line between the two primary positioning holes 3 and the mutual connection between the two secondary positioning holes 4 The lines are parallel and equal; the difference between the average value of the vertical distance between the two secondary positioning holes 4 and the adjacent sides of the forming area 11 and the average value of the vertical distance between the two primary positioning holes 3 on the same side and the adjacent sides of the forming area 11 is equal to the forming Area 11 edges process gong knife groove 2 widths. When cutting the plate body in th...

specific Embodiment approach 2

[0025] like figure 2 As shown, a precision PCB blank board provided in this embodiment includes a blank board body 1, the middle part of the board body is a forming area 11, and the board body is provided with two first-stage Positioning hole 3; three sides of the plate body are provided with secondary positioning holes 4, two sides are not provided with secondary positioning holes 4, secondary positioning holes 4 are located outside the forming area 11, and the side with secondary positioning holes 4 is one side and its The two sides 12 of opposite angles make it possible to clamp the molding area 11 when the secondary positioning holes 4 are used for installation and positioning. The connection line between the two primary positioning holes 3 and the mutual connection line between the two secondary positioning holes 4 are parallel and equal; the average value of the vertical distance between the two secondary positioning holes 4 and the adjacent sides of the molding area 11...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a precision PCB blank board and a processing and molding method thereof, belonging to the field of PCB boards. The precision PCB blank board disclosed by the invention includes a blank board body, the middle part of the blank board body is a forming area, and each of the forming areas First-level positioning holes are set on the outer sides of the strips; at least two sides of the blank body are provided with second-level positioning holes, and the average value of the vertical distance from the second-level positioning holes to the adjacent side of the forming area is the same as the average value of the vertical distance from the first-level positioning hole to the adjacent side of the forming area. The difference between the average values ​​of the vertical distances is equal to the width of the gong cutter groove processed on the edge of the forming area. After using the first-level positioning hole to fix and mill a few sides, switch the second-level positioning hole to the position of the first-level positioning hole, so that the side can just clamp the blank plate, so that it is convenient to fix and mill the last side to ensure the accuracy of the shape and size.

Description

technical field [0001] The invention relates to the field of PCB boards, in particular to a precision PCB blank board and a processing and forming method thereof. Background technique [0002] As we all know, with the rapid development and rapid development of electronic devices, people are pursuing high-precision, high-level, high-integration circuit boards, and ultra-thin and small-sized circuit boards are more popular. At present, all pcb manufacturers can only use the traditional "adhesive tape fixing method" and "pin positioning method" to solve the shape processing method without positioning holes in the board, that is, after finishing the three sides of the pcb, use tape or Dowels secure it on three sides, and then on the last side. However, the "adhesive tape fixing method" will not be able to effectively fix the tape due to insufficient adhesive tape, and will also leave traces of glue on the board surface of the pcb. While the dimensional tolerance of the pcb can...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K1/0266H05K3/0008H05K3/0044
Inventor 陈定成
Owner 信丰迅捷兴电路科技有限公司