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Vapor chamber

一种均热板、散热设备的技术,应用在热交换设备、间接换热器、照明和加热设备等方向,能够解决热输送能力降低、热路径截面积减少等问题,达到避免干涉的效果

Pending Publication Date: 2019-12-13
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the cross-sectional area of ​​the heat path in the internal space is reduced, and the heat transfer capability is reduced

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0038] The plan view of the vapor chamber 1a of the embodiment shown below is as follows: figure 1 As shown, the A-A section view is shown as figure 2 As shown, the B-B section view is shown as image 3 shown.

[0039] like figure 1 , figure 2 and image 3 As shown, the vapor chamber 1 a has a casing 4 composed of opposing first sheet material 2 and second sheet material 3 joined at their outer edges. A core body 6 is arranged in the inner space 5 of the casing 4 . In order to secure an internal space 5 in the case 4, between the first sheet 2 and the core 6, a first column 7 for supporting the first sheet 2 and the second sheet 3 from inside is provided. A second column 8 is provided between the second sheet 3 and the core 6 . The first sheet 2 and the second sheet 3 approach each other in an area outside the area where the first post 7 is provided, and contact, join, and seal at the outer edge. Hereinafter, the part where the 1st sheet|seat 2 and the 2nd sheet|se...

Embodiment approach 2

[0072] The B-B sectional view of the vapor chamber 1b of this embodiment is as follows Figure 4 shown. In addition, the vapor chamber 1b has the same structure except the structure of the 2nd area|region 17 being different from the said heat chamber 1a. That is, the planar configuration of the vapor chamber 1b is as follows figure 1 As shown, the A-A section is constructed as figure 2 as shown.

[0073] like Figure 4 As shown, the vapor chamber 1 b of the present embodiment does not have the first columns 7 in the second region 17 . That is, the vapor chamber 1b has the second sheet 3, the second column 8, the core 6, and the first sheet 2 in order from the second sheet 3 side (from the lower side of the drawing) at the second region 17, The core 6 is in contact with the first sheet 2 . According to the present embodiment, the thickness of the second region can be reduced by the height of the first column 7 . That is, T−t (difference between T and t) corresponds to ...

Embodiment approach 3

[0075] The B-B sectional view of the vapor chamber 1c of this embodiment is as follows Figure 5 shown. In addition, the vapor chamber 1c has the same structure except the structure of the 2nd area|region 17 being different from the said heat chamber 1a. That is, the planar configuration of the vapor chamber 1c is as follows figure 1 As shown, the A-A section is constructed as figure 2 as shown.

[0076] like Figure 5 As shown, the vapor chamber 1c of this embodiment does not have the core body 6 between the 1st pillar 7 and the 2nd sheet|seat 3 in the 2nd area|region 17. That is, in the second region 17 of the vapor chamber 1c, the second sheet 3, the second column 8, the first column 7, and the first sheet 3 are present in order from the second sheet 3 side (from the lower side in the drawing). Material 2, the first column 7 is in contact with the second column 8. According to this embodiment, the thickness of the second region can be reduced by the thickness of the c...

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Abstract

The present invention provides a vapor chamber having a casing, an operation medium sealed into an interior space in the casing, and a wick disposed in the interior space in the casing, wherein the vapor chamber has a first region and a second region in plan view, and the thickness of the second region is less than the thickness of the first region.

Description

technical field [0001] This invention relates to vapor chambers. Background technique [0002] In recent years, the amount of heat generated due to higher integration and higher performance of components has increased. In addition, due to the development of miniaturization of products, the heat generation density has increased, so heat dissipation measures are more important. This situation is particularly remarkable in the field of mobile terminals such as smartphones and tablet PCs. In recent years, graphite sheets and the like have been frequently used as heat countermeasure members, but the amount of heat transport is insufficient, so the use of various heat countermeasure members has been studied. Among them, in order to transfer heat very efficiently, studies on the use of planar heat pipes, that is, vapor chambers, are progressing. [0003] The vapor chamber has a structure in which a core body for transporting the working medium by capillary force is provided insi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02F28D15/04
CPCF28D15/0233F28D15/046F28F21/081F28F2255/02
Inventor 久米宗一若冈拓生
Owner MURATA MFG CO LTD