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Electromagnetic shielding film, circuit board and a preparation method of electromagnetic shielding film

A technology of electromagnetic shielding film and circuit board, which is applied in the field of electronics and can solve the problems of electromagnetic interference and low shielding efficiency of electromagnetic shielding film

Pending Publication Date: 2020-02-07
GUANGZHOU FANGBANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shielding effectiveness of the electromagnetic shielding film with the above structure is low, resulting in the problem of electromagnetic interference in high-frequency and high-speed signal transmission.

Method used

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  • Electromagnetic shielding film, circuit board and a preparation method of electromagnetic shielding film
  • Electromagnetic shielding film, circuit board and a preparation method of electromagnetic shielding film
  • Electromagnetic shielding film, circuit board and a preparation method of electromagnetic shielding film

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Embodiment Construction

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0043] see figure 1 As shown, a kind of electromagnetic shielding film of the preferred embodiment of the present invention comprises a first shielding layer 1, a conductive adhesive layer 2, a second shielding layer 3 and an adhesive film layer 4, the first shielding layer 1, the conductive adhesive Layer 2, the second shielding layer 3 and the adhesive film layer 4 are stacked in sequence, and the side of the second shielding layer 3 close to the adhesive film la...

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Abstract

The invention relates to the technical field of electronics, and discloses an electromagnetic shielding film, a circuit board and a preparation method of electromagnetic shielding film. The electromagnetic shielding film comprises a first shielding layer, a conductive adhesive layer, a second shielding layer and an adhesive film layer which are sequentially stacked, wherein one surface, close to the adhesive film layer, of the second shielding layer is a non-flat surface. The conductive adhesive layer is arranged between the first shielding layer and the second shielding layer, so that multi-layer shielding of interference signals on the two sides of the electromagnetic shielding film is realized, and the interference signals on the two sides of the electromagnetic shielding film are effectively weakened; and redundant charges are guided into a stratum through the first shielding layer, the conductive adhesive layer and the second shielding layer, so that the shielding efficiency is greatly improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. Background technique [0002] With the rapid development of the electronics industry, electronic products are further developed toward miniaturization, light weight, and high-density assembly, which greatly promotes the development of flexible circuit boards, thereby realizing the integration of component devices and wire connections. Flexible circuit boards can be widely used in industries such as mobile phones, liquid crystal displays, communications and aerospace. [0003] Driven by the international market, functional flexible circuit boards dominate the flexible circuit board market, and an important indicator for evaluating the performance of functional flexible circuit boards is Electromagnetic Interference Shielding (EMI Shielding). With the integration ...

Claims

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Application Information

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IPC IPC(8): H05K9/00H05K1/02C09J7/29C09J9/02
CPCH05K9/0088H05K1/0218C09J7/29C09J9/02H05K2201/0715C09J2301/314C09J2301/16C09J2301/122
Inventor 苏陟张美娟朱海萍
Owner GUANGZHOU FANGBANG ELECTRONICS
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