The invention relates to the technical field of electronics, and discloses an electromagnetic shielding film, a circuit board, and a preparation method of the electromagnetic shielding film. The electromagnetic shielding film comprises a plurality of convex particles, a first shielding layer, N second shielding layers, a third shielding layer, and an adhesive film layer, wherein the first shielding layer, N second shielding layers, the third shielding layer, and the adhesive film layer are successively stacked. The side, which is close to the adhesive film layer, of the first shielding layer is set as a flat surface. The convex particles are distributed between the first shielding layer and the second shielding layer and between the second shielding layer and the third shielding layer. Theside, which is close to the adhesive film layer, of the third shielding layer is a non-flat surface. The non-flat surface of the third shielding layer can pierce the adhesive film layer and is connected with the ground layer of the circuit board when the electromagnetic shielding film is laminated with the circuit board. Ground failure caused by the fact that the conductive particles of the adhesive film layer are pulled apart when the adhesive film layer of the existing electromagnetic shielding film is expanded at high temperature is avoided. The connection of the electromagnetic shieldingfilm and the ground layer of the circuit board is ensured.