Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film

An electromagnetic shielding film and circuit board technology, applied in the field of electronics, can solve the problems such as the inability of the shielding layer to conduct grounding, the easy expansion of the adhesive film layer, and the impact on the reliability of the grounding.
CN110691497APending Publication Date: 2020-01-14GUANGZHOU FANGBANG ELECTRONICS
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
GUANGZHOU FANGBANG ELECTRONICS
Publication Date
2020-01-14

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Abstract

The invention relates to the technical field of electronics, and discloses an electromagnetic shielding film, a circuit board, and a preparation method of the electromagnetic shielding film. The electromagnetic shielding film comprises a plurality of convex particles, a first shielding layer, N second shielding layers, a third shielding layer, and an adhesive film layer, wherein the first shielding layer, N second shielding layers, the third shielding layer, and the adhesive film layer are successively stacked. The side, which is close to the adhesive film layer, of the first shielding layer is set as a non-flat surface. The convex particles are distributed between the first shielding layer and the second shielding layer and between the second shielding layer and the third shielding layer.The side, which is close to the adhesive film layer, of the third shielding layer is a non-flat surface. The non-flat surface of the third shielding layer can pierce the adhesive film layer and is connected with the ground layer of the circuit board when the electromagnetic shielding film is laminated with the circuit board. Ground failure caused by the fact that the conductive particles of the adhesive film layer are pulled apart when the adhesive film layer of the existing electromagnetic shielding film is expanded at high temperature is avoided. The connection of the electromagnetic shielding film and the ground layer of the circuit board is ensured.
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Description

technical field

[0001] The invention relates to the field of electronic technology, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. Background technique

[0002] With the rapid development of the electronics industry, electronic products are further developed toward miniaturization, light weight, and high-density assembly, which greatly promotes the development of flexible circuit boards, thereby realizing the integration of component devices and wire connections. Flexible circuit boards can be widely used in industries such as mobile phones, liquid crystal displays, communications and aerospace.

[0003] Driven by the international market, functional flexible circuit boards dominate the flexible circuit board market, and an important indicator for evaluating the performance of functional flexible circuit boards is Electromagnetic Interference Shielding (EMI Shielding). With the integration ...

Claims

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