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Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film

An electromagnetic shielding film and circuit board technology, applied in the field of electronics, can solve the problems such as the inability of the shielding layer to conduct grounding, the easy expansion of the adhesive film layer, and the impact on the reliability of the grounding.

Pending Publication Date: 2020-01-14
GUANGZHOU FANGBANG ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the electromagnetic shielding film commonly used in existing circuit boards includes a shielding layer and an adhesive film layer containing conductive particles. The shielding layer is connected to the ground layer of the circuit board through the adhesive film layer containing conductive particles. , the adhesive film layer is easy to expand and the conductive particles of the adhesive film layer are pulled apart, so that the shielding layer cannot be grounded through the adhesive film layer and the ground layer of the circuit board, thus affecting the reliability of grounding

Method used

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  • Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
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  • Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film

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Embodiment Construction

[0046]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0047] combine figure 1 , figure 2 and Figure 4 As shown, an electromagnetic shielding film in a preferred embodiment of the present invention includes a first shielding layer 1, a second shielding layer 2 and an adhesive film layer 4, and the first shielding layer 1 is close to the side of the second shielding layer 2 It is an uneven surface, and the first shielding layer 1 is provided with convex conductor particles 5 on the side close to the second shielding ...

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Abstract

The invention relates to the technical field of electronics, and discloses an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. The electromagnetic shielding film comprises a first shielding layer, a second shielding layer, and an adhesive film layer. The side, which is near the second shielding layer, of the first shielding layer is anon-flat surface. Convex conductor particles are arranged on the side, which is near the second shielding layer, of the first shielding layer. The second shielding layer is arranged on the first shielding layer and covers the conductor particles, so that the side, which is away from the first shielding layer, of the second shielding layer is a non-flat surface. The second shielding layer can pierce the adhesive film layer and is connected with the ground layer of the circuit board when the electromagnetic shielding film is laminated with the circuit board. Ground failure caused by the fact that the conductive particles of the adhesive film layer are pulled apart when the adhesive film layer of the existing electromagnetic shielding film is expanded at high temperature is avoided.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. Background technique [0002] With the rapid development of the electronics industry, electronic products are further developed toward miniaturization, light weight, and high-density assembly, which greatly promotes the development of flexible circuit boards, thereby realizing the integration of component devices and wire connections. Flexible circuit boards can be widely used in industries such as mobile phones, liquid crystal displays, communications and aerospace. [0003] Driven by the international market, functional flexible circuit boards dominate the flexible circuit board market, and an important indicator for evaluating the performance of functional flexible circuit boards is Electromagnetic Interference Shielding (EMI Shielding). With the integration ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K1/02B32B33/00B32B3/08
CPCH05K9/0088H05K1/0218B32B33/00B32B3/08H05K2201/0715B32B2307/212
Inventor 苏陟
Owner GUANGZHOU FANGBANG ELECTRONICS
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