Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film

Abstract

The invention relates to the technical field of electronics, and discloses an electromagnetic shielding film, a circuit board, and a preparation method of the electromagnetic shielding film. The electromagnetic shielding film comprises a shielding layer and an adhesive film layer. The adhesive film layer is arranged on the shielding layer. The side, which is close to the adhesive film layer, of the shielding layer, is a non-flat surface with the same undulation. The side, which is close to the adhesive film layer, of the shielding layer is provided with convex conductor particles. The conductor particles can pierce the adhesive film layer and is connected with the ground layer of the circuit board when the electromagnetic shielding film is laminated with the circuit board. Ground failure caused by the fact that the conductive particles of the adhesive film layer are pulled apart when the adhesive film layer of the existing electromagnetic shielding film is expanded at high temperatureis avoided. The connection of the shielding layer and the ground layer of the circuit board is ensured.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. Background technique [0002] With the rapid development of the electronics industry, electronic products are further developed toward miniaturization, light weight, and high-density assembly, which greatly promotes the development of flexible circuit boards, thereby realizing the integration of component devices and wire connections. Flexible circuit boards can be widely used in industries such as mobile phones, liquid crystal displays, communications and aerospace. [0003] Driven by the international market, functional flexible circuit boards dominate the flexible circuit board market, and an important indicator for evaluating the performance of functional flexible circuit boards is Electromagnetic Interference Shielding (EMI Shielding). With the integration ...

AI Technical Summary

Problems solved by technology

[0004] At present, the electromagnetic shielding film commonly used in existing circuit boards includes a shielding layer and an adhesive film layer containing conductive particles. The shielding layer is connected to the ground layer of the circuit board through the adhesive film layer containing conductive particles. , the adhesive film layer is easy to expand and the conductive particles of the adhesive film layer are pulled apart, so that the shielding layer cannot be grounded through the adhesive film layer and the ground layer of the circuit board, thus affecting the reliability of grounding

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