A reflux defoaming system for an electroplating process tank

An electroplating process and defoaming technology, applied in the direction of electrolytic components, electrolytic process, cells, etc., can solve problems such as easy generation of bubbles and affect the quality of product electroplating, and achieve the effect of eliminating bubbles, reducing oxidation and ensuring stability

Active Publication Date: 2021-01-26
广德东威科技有限公司
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  • Abstract
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Problems solved by technology

[0007] Therefore, the technical problem to be solved in the present invention is to overcome the problem that the electroplating solution in the plating solution circulation system of the electroplating tank in the prior art is easy to generate bubbles when reflowing, thereby affecting the electroplating quality of the product, thereby providing an electroplating process tank. Reflux defoaming system

Method used

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  • A reflux defoaming system for an electroplating process tank
  • A reflux defoaming system for an electroplating process tank
  • A reflux defoaming system for an electroplating process tank

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Embodiment Construction

[0061] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0062] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention discloses a reflux defoaming system for an electroplating process tank, which comprises: an upper tank body with a through opening for a plate to be plated to pass through; The lower tank is located below the upper tank, and the bottom of the lower tank is equipped with a partition that divides the inner space of the lower tank into a recirculation zone and a defoaming zone; the bubble layer above the plating solution or cleaning solution in the reflow zone flows from the partition The top of the plate overflows and enters the defoaming area; the overflow box communicates with the liquid discharge port on the side of the upper tank opposite to the drainage tank, and the discharge pipe leading to the return area is connected to the bottom of the overflow box; the defoaming device is located in the Above the defoaming zone, a negative pressure zone is formed above the defoaming zone to suck away the bubbles in the recirculation zone and shear and eliminate the bubbles. By installing a discharge pipe between the upper tank and the lower tank, and installing a partition and a defoaming device in the lower tank, the bubbles in the electroplating solution or cleaning solution obtained by backflow can be eliminated, and the influence of bubbles on the plating quality of the product can be reduced. .

Description

technical field [0001] The invention relates to the technical field of electroplating equipment, in particular to a reflux defoaming system for an electroplating process tank. Background technique [0002] The common vertical electroplating equipment drives the circuit board to run along the electroplating tank filled with electroplating solution through the circulating transmission device. The circuit board continuously enters from one end of the electroplating tank and outputs from the other end. The electroplating ions in the electroplating solution are Electroplating is done on the surface of the circuit board during this process. [0003] The current electroplating process tank includes an electroplating tank located in the upper part for electroplating the circuit board, a liquid storage tank located in the lower part for recycling the electroplating solution, and a return tank located between the electroplating tank and the liquid storage tank. The electroplating tank...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/18C25D21/20C25D21/04
CPCC25D21/04C25D21/18C25D21/20
Inventor 韩海亚吴志鹏
Owner 广德东威科技有限公司
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