Antenna package modules and electronic equipment

An antenna and molding technology, applied in the directions of antenna, antenna support/installation device, antenna coupling, etc., can solve problems such as application limitations of millimeter-wave packaged antenna modules

Active Publication Date: 2021-06-08
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the application of millimeter-wave packaged antenna modules in circular polarization scenarios is still limited

Method used

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  • Antenna package modules and electronic equipment
  • Antenna package modules and electronic equipment
  • Antenna package modules and electronic equipment

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Embodiment Construction

[0029] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0030] It can be understood that the terms "first", "second" and the like used in this application may be used to describe various elements herein, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element, and should not be interpreted as indicating or implying relative importance or implying the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "...

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Abstract

The present application relates to an antenna packaging module and electronic equipment. The antenna packaging module includes: an antenna substrate having a first side and a second side arranged opposite to each other; a first laminated circuit arranged on the first side of the antenna substrate On one side, the side of the first laminated circuit away from the antenna substrate is used to set the radio frequency chip; the radiation structure is arranged on the second side of the antenna substrate; and the feed network includes 90 arranged in the first laminated circuit ° A directional coupling structure and a transmission line running through the antenna substrate and the first laminated circuit. By introducing a 90° directional coupling structure and connecting it to the RF chip and the radiation structure through transmission lines, it is possible to feed the radiation structure so that the radiation structure can achieve circularly polarized radiation, and improve the isolation between the feeding ports and reduce the Mutual coupling between antenna elements.

Description

technical field [0001] The present application relates to the technical field of antennas, in particular to an antenna packaging module and electronic equipment. Background technique [0002] With the development of wireless communication technology, 5G network technology is also born. As the fifth-generation mobile communication network, 5G network has a peak theoretical transmission speed of tens of Gb per second, which is hundreds of times faster than that of 4G network. Therefore, the millimeter wave frequency band with sufficient spectrum resources has become one of the working frequency bands of the 5G communication system. [0003] The millimeter-wave packaged antenna module is the mainstream packaging solution in the future 5G millimeter-wave electronic equipment. It can adopt a multi-layer PCB high-density interconnection process and set a radiation structure on one side of the module. However, the application of millimeter-wave packaged antenna modules in circula...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q21/08H01Q21/00H01Q1/52H01Q1/50H01Q1/38H01Q1/24H01Q1/22H01P5/18
CPCH01P5/184H01Q1/22H01Q1/2266H01Q1/243H01Q1/38H01Q1/50H01Q1/523H01Q21/00H01Q21/0006H01Q21/08
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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