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Wiring layer structure, preparation method thereof and bonding pad structure

A wiring layer and pad technology, applied in the field of pad structure, can solve problems such as uprooting or partial peeling, poor mechanical strength, and damage to the pad structure

Pending Publication Date: 2020-05-29
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The mechanical strength of the structure of the existing wiring layer is not good, and it is easy to cause the risk of the pad and the dielectric in the wiring layer being uprooted or partially peeled off when the lead wire is bonded to the package, and the pad structure is damaged.

Method used

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  • Wiring layer structure, preparation method thereof and bonding pad structure
  • Wiring layer structure, preparation method thereof and bonding pad structure
  • Wiring layer structure, preparation method thereof and bonding pad structure

Examples

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Embodiment Construction

[0050] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0051] In related technologies, when the conductive material in the wiring layer is designed as a large-area metal structure (Bulk Type, such as figure 1 As shown), due to its poor bonding force between the metal and the dielectric in a large area, it will cause the risk of the pad being uprooted or partially peeled off together with the dielectric when the package wire bonding pulls the welding wire, destroying the pad struct...

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Abstract

The invention provides a wiring layer structure, a preparation method thereof and a bonding pad structure. The wiring layer structure comprises a dielectric medium; a wire layer is embedded in the dielectric medium; the wire layer comprises a frame body and connecting wires; the frame body at least comprises two openings; the frame body is divided into a plurality of sections; the connecting wiresare located in the frame body; each connecting wire is provided with a plurality of connecting ends connected to the frame body; the connecting wires divide the interior of the frame body into a plurality of areas; each section is connected with the connecting ends of any connecting wire; and each area is communicated with any opening. According to the wiring layer structure, the preparation method thereof and the bonding pad structure of the invention, the whole wire layer and the dielectric medium are separately of an integrated structure, and therefore, an adhesive force between the interior of the wire layer and the dielectric medium is improved, the mechanical strength of the structure of the dielectric medium is enhanced, and the resistance value of the wires communicated with a topbonding pad is not increased.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, in particular, to a wiring layer structure and a preparation method thereof, and also to a pad structure. Background technique [0002] In the field of semiconductor manufacturing, pads are widely used to connect semiconductor dies to component package pins, and pads are required to have good electrical conductivity and mechanical strength. [0003] The pad structure usually includes a wiring layer, and the wiring layer is used to layout the input and output ports of the pad, so as to improve the performance and reliability of the integrated circuit package. The structural mechanical strength of the existing wiring layer is not good, and it is easy to cause the risk that the pad and the dielectric in the wiring layer will be uprooted or partially peeled off when the wire is bonded and pulled, and the pad structure will be damaged. [0004] The above information disclosed in this B...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L23/485H01L23/488H01L21/48
CPCH01L21/4821H01L23/485H01L23/488H01L23/49H01L24/03H01L24/06H01L2224/05H01L2224/48463H01L2924/35121
Inventor 吴秉桓许緁娗
Owner CHANGXIN MEMORY TECH INC
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