Retaining ring cutting-off method

A technology for retaining rings and cutting tools, which is applied in metal processing and other directions, can solve the problems of failing to meet the quality requirements of retaining rings, poor flatness and parallelism of retaining rings, and high scrap rate of retaining ring products, so as to avoid the problem of sticking knives , Guaranteed quality, high stability effect

Inactive Publication Date: 2020-06-19
上海江丰平芯电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, due to the softness of the PPS material, the problem of knife sticking is easy to occur during the process of cutting the PPS retaining ring ingot to prepare the retaining ring, resulting in poor flatness and parallelism of the retaining ring, which cannot meet the quality requirements of the retaining ring product at all. , leading to a high scrap rate of retaining ring products; in addition, the existing PPS retaining ring ingot cutting method has poor stability, the waste of retaining ring ingot is serious, and the material cost is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] This embodiment provides a retaining ring cutting method, which includes the following steps:

[0037] (1) Fixing a cutting tool with a thickness of 1mm on the feed device, and the feeding device positions the cutting tool at the initial cutting position;

[0038] Wherein, the cutting tool is a circular tool with a diameter of 125mm;

[0039] The inner hole diameter of the cutting tool is 25.4mm;

[0040] The number of saw teeth of the cutting tool is 80;

[0041] The material of the cutting tool is tungsten steel;

[0042] (2) Carry out the cutting operation according to the preset cutting parameters until a complete retaining ring is obtained after cutting;

[0043] Wherein, the cutting speed of the cutting parameters is 1550m / min;

[0044] The feed rate for the cut-off parameter is 110 m / min.

[0045] The cutting method described in this embodiment does not have the problem of sticking to the knife, and the obtained retaining ring product has good flatness and p...

Embodiment 2

[0047] This embodiment provides a retaining ring cutting method, which includes the following steps:

[0048] (1) Fixing a cutting tool with a thickness of 0.5mm on the feeding device, and the feeding device positions the cutting tool at the initial cutting position;

[0049] Wherein, the cutting tool is a circular tool with a diameter of 100mm;

[0050]The inner hole diameter of the cutting tool is 25.4mm;

[0051] The number of saw teeth of the cutting tool is 60;

[0052] The material of the cutting tool is tungsten steel;

[0053] (2) Carry out the cutting operation according to the preset cutting parameters until a complete retaining ring is obtained after cutting;

[0054] Wherein, the cutting speed of the cutting parameter is 1500m / min;

[0055] The feed rate for said cutting parameter is 100 m / min.

[0056] The cutting method described in this embodiment does not have the problem of sticking to the knife, and the obtained retaining ring product has good flatness a...

Embodiment 3

[0058] This embodiment provides a retaining ring cutting method, which includes the following steps:

[0059] (1) Fixing a cutting tool with a thickness of 3mm on the feeding device, and the feeding device positions the cutting tool at the initial cutting position;

[0060] Wherein, the cutting tool is a circular tool with a diameter of 150mm;

[0061] The inner hole diameter of the cutting tool is 25.4mm;

[0062] The number of saw teeth of the cutting tool is 120;

[0063] The material of the cutting tool is tungsten steel;

[0064] (2) Carry out the cutting operation according to the preset cutting parameters until a complete retaining ring is obtained after cutting;

[0065] Wherein, the cutting speed of the cutting parameter is 1600m / min;

[0066] The feed rate for said cutting parameter is 120 m / min.

[0067] The cutting method described in this embodiment does not have the problem of sticking to the knife, and the obtained retaining ring product has good flatness a...

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PUM

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Abstract

The invention relates to a retaining ring cutting-off method. The retaining ring cutting-off method comprises the following steps that (1) a cutting-off tool with the thickness of 0.5-3 mm is fixed afeeding device, and the feeding device positions the cutting-off tool at the initial cutting-off position; and (2) according to a preset cutting-off parameter, the cutting-off operation is performed until the cutting-off is finished to obtain a complete retaining ring. The knife sticking problem of a retaining ring ingot material to be cut off in the cutting-off process is solved through the collaborative design of the cutting-off tool and the cutting-off parameter, and the flatness and parallelism of retaining ring products are ensured, so that the scrap rate of the retaining ring products isreduced, and the quality of the retaining ring products is ensured; and the flatness and parallelism of the retaining ring products can reach 0.01-0.08mm; and in addition, the cutting-off method is high in stability, and the waste of the retaining ring ingot material to be cut off is avoided, so that the material cost is saved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for cutting a retaining ring. Background technique [0002] The application of chips in daily life is ubiquitous, and it is developing towards the trend of integration and miniaturization. The chip area of ​​labels and LED lamp beads is so small that it is almost imperceptible, such as subway tickets, concert tickets and so on. When performing delamination analysis on a chip, it is usually necessary to grind the chip in order to make the surface of the chip smooth and flat. [0003] At present, the chemical mechanical polishing method is generally used to realize the polishing process. The principle is to polish and peel off the excess film deposited on the surface of the chip through chemical reaction and mechanical action, so that the surface of the chip is smooth and flat. The specific process of the chemical mechanical polishing method is as fol...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): B26D1/00B26D1/157
CPCB26D1/0006B26D1/157B26D2001/006
Inventor姚力军惠宏业潘杰王学泽李力平周建军
Owner上海江丰平芯电子科技有限公司