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Pressure measuring device

A measurement device, pressure technology, applied in the direction of measurement device, microstructure device, fluid velocity measurement, etc., can solve the problems of time-consuming and expensive, complex contour, complicated manufacturing, etc.

Active Publication Date: 2020-07-03
EHNDRESS KHAUZER GMBKH KO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] However, both solutions have disadvantages: the base or the support (as the case may be) are components that are manufactured as separate parts and they have relatively complex contours, so they are complex to manufacture, time consuming and expensive

Method used

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Embodiment Construction

[0074] figure 1 An example of the pressure measuring device of the present invention is shown. The pressure measurement device includes a carrier 1 , a support body 3 arranged on the carrier 1 , and a pressure sensor 5 arranged on the support body 3 . figure 2 show figure 1 An enlarged view of the support body 3.

[0075] The pressure sensor 5 is, for example, a semiconductor pressure sensor, for example a pressure sensor chip made of silicon. In the illustrated example, such a pressure sensor comprises a platform 7 and a measuring membrane 9 arranged on the platform 7 , below which a pressure chamber 11 is enclosed. Alternatively, instead of the pressure sensor 5 shown here, it is of course also possible to use a pressure sensor having a design different therefrom.

[0076] The pressure measuring device may be realized as a differential pressure measuring device, as a relative pressure measuring device or as a gauge or absolute pressure measuring device.

[0077] To reg...

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Abstract

The invention relates to a pressure measuring device that can be cost-effectively produced and comprises a carrier (1), a support body (3) arranged on the carrier (1), a pressure sensor (5) arranged on the support body (3), a first join (17) containing a joining material and connecting the support body (3) to the pressure sensor (5), and a second join (19) containing a joining material and connecting the support body (3) to the carrier (1), wherein the pressure sensor is protected against thermomechanical tensions, wherein the support body (3) has a first groove (21) on the end side thereof facing the pressure sensor (5), which groove is designed in such a way that the first groove (21) externally completely surrounds a joining surface (23) of the support body (3) facing the pressure sensor (5), the joining surface (23) of the support body (3) and a base surface of the first join (17) are substantially the same size or purely smaller than a base surface of the pressure sensor (5) facing the first join (17), the first groove (21) has a width (b) that is greater than or equal to a minimum width of 150 [mu]m to 1 mm, and the first groove (21) has a depth (t) that is greater than or equal to a minimum depth of 0.3 mm to 2 mm.

Description

technical field [0001] The present invention relates to a pressure measurement device, which comprises: a carrier; a support, the support is arranged on the carrier; a pressure sensor, the pressure sensor is arranged on the support; a first joint, the The first bonding part includes a bonding material connecting the support body and the pressure sensor; and the second bonding part includes a bonding material connecting the support body and the carrier. Background technique [0002] Pressure measuring devices are used for the metered recording of pressure, especially absolute pressure, relative pressure and differential pressure, and are used in industrial measurement technology. [0003] In pressure measurement technology, so-called semiconductor pressure sensors are often used. In the prior art, semiconductor sensors are usually produced using silicon, for example by applying silicon-on-insulator (SOI) technology. They are realized, for example, as a pressure sensor chip ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L19/14G01L19/04B81B7/00
CPCG01L19/145G01L19/04G01L19/147B81B7/0048B81B2201/0264G01L9/0055
Inventor 雷内·齐尔曼丹尼尔·希克斯藤森丹尼斯·米勒
Owner EHNDRESS KHAUZER GMBKH KO KG
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