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pressure measuring device

A technology for measuring devices and pressure, applied in measuring devices, measuring fluid pressure, microstructure devices, etc., can solve problems such as complex contours, time-consuming and expensive, complex manufacturing, etc.

Active Publication Date: 2021-12-07
ENDRESS HAUSER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, both solutions have disadvantages: the base or the support (as the case may be) are components that are manufactured as separate parts and they have relatively complex contours, so they are complex to manufacture, time consuming and expensive

Method used

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Examples

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Embodiment Construction

[0074] figure 1 An example of the pressure measuring device of the present invention is shown. The pressure measurement device includes a carrier 1 , a support body 3 arranged on the carrier 1 , and a pressure sensor 5 arranged on the support body 3 . figure 2 show figure 1 An enlarged view of the support body 3.

[0075] The pressure sensor 5 is, for example, a semiconductor pressure sensor, for example a pressure sensor chip made of silicon. In the illustrated example, such a pressure sensor comprises a platform 7 and a measuring membrane 9 arranged on the platform 7 , below which a pressure chamber 11 is enclosed. Alternatively, instead of the pressure sensor 5 shown here, it is of course also possible to use a pressure sensor having a design different therefrom.

[0076] The pressure measuring device may be realized as a differential pressure measuring device, as a relative pressure measuring device or as a gauge or absolute pressure measuring device.

[0077] To reg...

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PUM

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Abstract

A cost-effectively producible pressure measuring device is described, comprising a carrier (1), a support (3) arranged on the carrier (1), a pressure measuring device arranged on the support (3) The sensor (5), the first joint part (17) and the second joint part (19), the first joint part (17) contains the joint material and connects the support (3) and the pressure sensor (5), the second joint The part (19) contains the bonding material and connects the support body (3) with the carrier (1), wherein the pressure sensor is protected from thermomechanical stress, wherein the support body (3) has on its end face side facing the pressure sensor (5) a The first groove (21), which is designed in such a way that the first groove (21) completely surrounds the joint facing the pressure sensor (5) of the support (3) on the outside The surface (23), the joint surface (23) of the support body (3) and the base surface of the first joint (17) are substantially equal in size, or are purely smaller than the surface of the pressure sensor (5) facing the first joint (17). base surface. The width (b) of the first groove (21) is greater than or equal to a minimum width of 150 μm to 1 mm, and the depth (t) of the first groove (21) is greater than or equal to a minimum depth of 0.3 mm to 2 mm.

Description

technical field [0001] The present invention relates to a pressure measurement device, which comprises: a carrier; a support, the support is arranged on the carrier; a pressure sensor, the pressure sensor is arranged on the support; a first joint, the The first bonding part includes a bonding material connecting the support body and the pressure sensor; and the second bonding part includes a bonding material connecting the support body and the carrier. Background technique [0002] Pressure measuring devices are used for the metered recording of pressure, especially absolute pressure, relative pressure and differential pressure, and are used in industrial measurement technology. [0003] In pressure measurement technology, so-called semiconductor pressure sensors are often used. In the prior art, semiconductor sensors are usually produced using silicon, for example by applying silicon-on-insulator (SOI) technology. They are realized, for example, as a pressure sensor chip ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/02
CPCG01L19/145G01L19/04G01L19/147B81B7/0048B81B2201/0264G01L9/0055
Inventor 雷内·齐尔曼丹尼尔·希克斯藤森丹尼斯·米勒
Owner ENDRESS HAUSER INC
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