IC chip mounting device capable of avoiding overflow

Abstract

The invention provides an IC chip mounting device capable of avoiding overflow, which comprises a platform, wherein the inner top wall of a bracket is connected with an adjusting base through a telescopic rod, the front surface of the adjusting base is rotationally connected with a rotating base, an inserting plate is movably inserted into the bottom of the adjusting base, a disc inserted into theadjusting base is rotatably connected to the back surface of the inserting plate, an arc groove corresponding to the disc is formed in the front surface of the adjusting base, a measuring rod is fixedly connected to the bottom of the adjusting base, a welding gun is movably inserted into the supporting plate, and the inserting plate is movably connected with the welding gun through a connecting rod. The rotating base drives the inserting plate to continuously rotate; when the disc is located outside the arc groove, the inserting plate pulls the welding gun to move up and down through the connecting rod; when the disc rotates into the arc groove, the height of the welding gun is kept unchanged; and when a chip stays below the welding gun, the welding gun can weld the chip, the welding gunmoves upwards after welding is finished, and the function of automatically welding and mounting the chip is achieved.

Description

technical field [0001] The invention relates to the technical field of IC chip placement, in particular to an IC chip placement device for avoiding overflow. Background technique [0002] With the continuous development of electronic technology, the integration of chips is getting higher and higher. The related products of IC chips include the chips and the leads connecting the chips with other functional circuits. The packaging of the chips can effectively guarantee the performance and reliability of the products. , At the same time, the low cost of packaging can further reduce the production cost of the product. [0003] The IC chip needs to be mounted by welding in the package. Generally, the welding ring on the chip and the window is designed as a flat structure. area, resulting in a large piece of solder in the unnecessary area outside (inside) of the IC chip, affecting the appearance of the product, even endangering the performance of the product, and reducing the yie...

AI Technical Summary

Problems solved by technology

[0003] The IC chip needs to be mounted by welding in the package. Generally, the welding ring on the chip and the window is designed as a flat structure. area, resulting in a large piece of solder in the unnecessary area outside (inside) of the IC chip, affecting the appearance of the product, even endangering the performance of the product, and reducing the yield rate of the product

Images