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Die-cutting equipment for printed circuit boards

A printed circuit board and die-cutting technology, used in metal processing equipment, grinding/polishing equipment, manufacturing tools, etc., can solve problems such as burrs on square circuit boards, inability to grind square circuit boards, and affecting cutting operations.

Active Publication Date: 2021-12-31
江西中信华电子工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The following problems often exist in the process of cutting printed circuit boards: 1. Printed circuit boards are often cut into square circuit boards of appropriate size during the production process, but the square circuit boards are easily separated from the original printed circuit boards after cutting. As a result, the square circuit board cannot continue to be fed, and thus accumulates at the cutting position and affects the next cutting operation; 2. There are often burrs around the square circuit board and the margin left during cutting, but the existing equipment cannot be used for the square circuit board due to space problems. Effective grinding around the circuit board

Method used

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  • Die-cutting equipment for printed circuit boards
  • Die-cutting equipment for printed circuit boards
  • Die-cutting equipment for printed circuit boards

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Embodiment Construction

[0025] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0026] Such as Figure 1 to Figure 6 As shown, the present invention adopts the following technical solutions to achieve: a printed circuit board die-cutting equipment, including a base 1, a feed guide unit 2 and a cutting and blanking unit 3, and the upper end of the base 1 is provided with a feed guide unit 2 , the middle part of the upper end of the base 1 is provided with a cutting and blanking unit 3; the feed guide unit 2 limits the position of the printed circuit board while feeding the printed circuit board, so that the printed circuit board is close to the upper surface of the base, and the cutting and blanking unit 3 The printed circuit board is cut, and the two square circuit boards cut at the same time are divided into guides, so tha...

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Abstract

The invention relates to a printed circuit board die-cutting device, which includes a base, a feeding guide unit and a cutting and blanking unit. The method of feeding the printed circuit board intermittently makes the circuit board not deviate and damage the incision during cutting. By cutting out the square incision first, and then cutting this secondary cutting method, it prevents the square circuit board from being easily separated from the original during the first cutting process. Printed circuit boards are separated, so that they are piled up at the cutting position and affect the next cutting operation; the invention feeds the square circuit boards on the front and rear sides separately, so that the square circuit boards are fed in the opposite direction, so that no additional grinding space is required Just can finish the polishing operation to square circuit board.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, in particular to a die-cutting device for printed circuit boards. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Printed circuit boards are mostly represented by "PCB" instead of "PCB boards". Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves automation and production labor rates. According to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. [0003] The following problems often exist in the process of cutting printed circuit boards: 1. Printed circuit boards are often cut into square circuit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26F1/38B24B21/00B24B21/04B24B21/18B24B27/00B24B47/20B26D5/12B26D7/06B26D11/00
CPCB26F1/38B26D7/06B26D5/12B26D11/00B24B21/008B24B21/002B24B21/04B24B27/0069B24B21/18B24B47/20
Inventor 李业国郑小华黄福军赖春生
Owner 江西中信华电子工业有限公司