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Transfer method of light-emitting element and display backplane

A light-emitting element and transfer method technology, which is applied in the direction of electrical components, semiconductor devices, electric solid-state devices, etc., can solve the problems of poor effect and low transfer efficiency

Active Publication Date: 2021-06-22
深圳市TCL高新技术开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a method for transferring light-emitting elements, aiming to solve the problems of low transfer efficiency and poor effect in traditional mass transfer technology

Method used

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  • Transfer method of light-emitting element and display backplane
  • Transfer method of light-emitting element and display backplane
  • Transfer method of light-emitting element and display backplane

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Embodiment Construction

[0053] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0054] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0055] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other...

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Abstract

This application relates to the field of display backlight manufacturing technology, and provides a method for transferring light-emitting elements. By providing a light-absorbing material layer on the source substrate of the light-emitting element, when the light-emitting element is bonded to the circuit board and the light-emitting element is peeled off, the light-absorbing material The layer can absorb the laser and melt completely without residue, and it will not affect the light emitting effect of the light-emitting element. It solves the problem that the laser will burn the elastic material, and will produce a layer of black matter on the light-emitting element that is difficult to clean, affecting the light-emitting element The light problem.

Description

technical field [0001] The application belongs to the technical field of display backlight manufacturing, and in particular relates to a method for transferring a light-emitting element and a display backplane. Background technique [0002] The design of most electronic circuit products involves the combination of electronic components. In many cases, electronic components (such as light-emitting diodes) and their substrates must be made of different materials due to limitations in material growth techniques, thus requiring the transfer of electronic components from their native substrates to application substrates. The current mainstream transfer technology is carried out by mechanical method, which is suitable for electronic components with large area and small quantity. At present, some emerging applications require the transfer of a large number of micron-scale electronic components (such as micro light-emitting diodes, Micro LEDs), which exceeds the capabilities of tra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L21/683
CPCH01L21/6835H01L25/167H01L2221/68368H01L2221/68381
Inventor 闫晓林林智远谢相伟
Owner 深圳市TCL高新技术开发有限公司