Cutting machining device for building insulation board and cutting machining method

Abstract

The invention relates to a cutting machining device for a building insulation board and a cutting machining method. The cutting machining device for the building insulation board comprises a group ofunderframe components, a moving assembly is arranged above each underframe assembly, a cross beam frame is arranged at the upper ends of the two moving assemblies, a first movable bracket assembly anda second movable bracket assembly are arranged on the cross beam frame, a laser cutting assembly is arranged on the first movable bracket assembly, a three-dimensional scanner is arranged on the second movable bracket assembly, a support plate is further arranged at the front end of the upper portion of one moving assembly, a control device is arranged on the support plate, and a power supply device is arranged at the rear end of the upper portion of the moving assembly. The invention also provides the cutting processing method. The cutting power of a laser cutter is controlled by parameter information of the shape, the thickness, the corner, the hollow, the solid and the thin wall of each unit (such as 1 cm of wide distance) of the building insulation board.

Description

technical field [0001] The invention relates to the technical field of laser gas cutting machines, in particular to a cutting processing device for building thermal insulation boards, in particular to a cutting processing device and a cutting processing method for building thermal insulation boards. Background technique [0002] Laser cutting technology is used in various industries. Generally, the cutting of building insulation boards is done with a cutter. Since different building surfaces require different specifications and shapes of building insulation boards, cutting special-shaped building insulation boards with a cutter requires many At the same time, there are errors in the cutting of the cutter, so that the specifications of the building insulation board cannot be unified. Contents of the invention [0003] The purpose of the present invention is to provide a cutting processing device and a cutting processing method for building insulation boards, so as to solv...

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Problems solved by technology

[0002] Laser cutting technology is used in various industries. Generally, the cutting of building insulation boards is done with a cutter. Since different building surfaces require different specifications and shapes of building insulation boards, cutting special-shaped building insulation boards with a cutter requires many Only one process can meet the requirements. At the same time, there are errors in the cutting of the cutter, so that the specifications of the building insulation board cannot be unified.

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