Durable heat dissipation circuit board
A circuit board, durable technology, applied in the direction of cooling/ventilation/heating transformation, modification through conduction heat transfer, electrical components, etc., can solve the problems of circuit board temperature rise, easy heat generation, circuit board influence, etc., to achieve gas The circulation is smooth, the effect of increasing the cooling effect and increasing the heat dissipation effect
Active Publication Date: 2020-12-11
浙江锴达科技有限公司
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Problems solved by technology
[0003] During the use of the circuit board, because the electronic components installed on its surface are easy to generate heat, part of the heat will be conducted to the circuit board, causing the temperature of the circuit board to rise rapidly, and the temperature rise of the circuit board is easy to affect other parts that are not heated. parts that affect
Method used
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Embodiment
[0023] Embodiment: a durable heat dissipation circuit board, such as Figure 1-Figure 8 As shown, it includes a side seal frame 1 and a corner cover 4. The top and bottom of the side seal frame 1 are provided with a number of heat dissipation holes 102. The sides of the heat dissipation holes 102 are inclined to avoid external For the accumulation of dust, the cooling holes 102 at the top penetrate downwards to the inside of the first air intake passage 101, and the cooling holes 102 at the bottom penetrate upwards to the inside of the first air intake passage 101. The inner rear side wall of the first air intake passage 101 There are two filling strips 2 on the top, by setting the filling strips 2 to increase the pressure of the gas entering, thereby increasing the overall heat dissipation effect, the cross section of the filling strips 2 is triangular, and the lateral central axis of the front side of the side sealing frame 1 is provided with a feed port 103, the inside of t...
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The invention discloses a durable heat dissipation circuit board, and belongs to the technical field of circuit boards. The circuit board comprises a side edge sealing frame and a corner sealing sleeve, and is characterized in that heat dissipation holes are formed in the top and the bottom of the side edge sealing frame, the heat dissipation hole located in the top downwards penetrates into a first air inlet channel, the heat dissipation hole located in the bottom upwards penetrates into the first air inlet channel, and a feeding port is formed in the transverse central axis of the front faceof the side edge sealing frame. By arranging the side edge sealing frame, the side edge sealing frame can be connected with the side edge of the circuit board in an inserted mode, the two sets of clamping bases clamped with the circuit board in the side edge sealing frame are used for clamping the side edge sealing frame, and the mutual lap joint positions of the first top clamping planes of theopposite faces of the two sets of clamping bases and the circuit board are coated with heat conduction silicone grease, so that heat conduction of the circuit board is improved; heat dissipation is carried out by the multiple clamping bases, heat dissipated by the clamping bases is accumulated in the through cavity, and heat dissipation treatment is carried out in cooperation with the heat dissipation holes communicating with the top and the bottom of the through cavity.
Description
technical field [0001] The invention belongs to the technical field of circuit boards, in particular to a durable heat dissipation circuit board. Background technique [0002] According to the number of layers, circuit boards are divided into three major categories: single-panel, double-panel, and multi-layer circuit boards: the first is single-panel, on the most basic PCB, the parts are concentrated on one side, and the wires are concentrated on the other. on the one hand. Because the wires only appear on one side, this kind of PCB is called a single-sided circuit board. The double-sided board is an extension of the single-sided board. Both sides have copper clad and traces, and the two layers can be connected through holes. The lines between them make it form the required network connection. The multilayer board refers to a printed board with more than three conductive pattern layers and the insulating material between them laminated at intervals, and the conductive patte...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/205
Inventor 唐芬娟
Owner 浙江锴达科技有限公司