Method for carrying out surface activation treatment on surface of copper alloy

A surface activation treatment, copper alloy technology, applied in the field of activation, can solve the problems that it is difficult to ensure the bonding force between copper/copper alloy materials and the coating, rust or other dirt is not completely removed, and production efficiency is restricted, so as to achieve rapid oxidation removal layer, improve the effect of insufficient activation or excessive etching, and enhance the bonding force of the coating
CN112160002AActive Publication Date: 2021-01-01崇辉半导体(深圳)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
崇辉半导体(深圳)有限公司
Publication Date
2021-01-01

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Abstract

The invention discloses a method for carrying out surface activation treatment on the surface of a copper alloy. The method comprises the following steps that (1) electrolytic degreasing and water washing are carried out on a copper alloy to-be-electroplated part; 2) the copper alloy to-be-electroplated part subjected to electrolytic degreasing and water washing is conveyed into an activating solution, and is activated at room temperature, and the activating solution is prepared from the following components of an agent A, an agent B and sulfuric acid, wherein the agent A is prepared from thefollowing components of, in percentage by volume, 70%-90% of sodium persulfate, 0.5%-5% of sodium chloride, 5%-15% of citric acid and 4%-10% of urea; and the agent B is prepared from the following components of a nonionic surfactant, ferric oxide and deionized water; and 3) the activated copper alloy to-be-electroplated part is washed with water and dried to obtain an electroplated product. The method has the advantages that insufficient activation or excessive etching of copper and copper alloy materials is improved, the production process is stable, and the method can adapt to the copper andcopper alloy materials with different components.
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Description

technical field

[0001] This application relates to the technical field of activation in the LED electroplating industry, in particular to a method for surface activation treatment on the surface of a copper alloy. Background technique

[0002] Electroplating is a process in which the piece to be electroplated is used as a cathode in an electrolyte solution containing a certain metal ion, and a low-voltage current of a certain waveform is passed through to make the metal ion obtain electrons on the surface of the cathode and reduce it to a simple metal substance, which is continuously deposited as a metal coating. . During the process of processing, transportation, storage, etc., the surface of the parts to be electroplated often has an oxide layer, microscopic protruding points, rust or other dirt. Dirt makes the surface of different copper or copper alloy materials rough and uneven, resulting in different surface roughness on the surface of different copper or copper alloy...

Claims

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