Heat dissipation plate, method of making same and electronic device having same
A manufacturing method and heat dissipation plate technology, applied in cooling/ventilation/heating transformation, electrical components, indirect heat exchangers, etc., can solve the problems of high heat conduction efficiency and limited heat transfer ability, and reduce time and cost effect
Active Publication Date: 2021-01-12
THERLECT CO LTD
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Problems solved by technology
Furthermore, the heat conduction plate conducts heat through steam flow, so its ability to carry heat is limited, so its heat conduction efficiency is still not as high as that of liquid cooling.
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[0030] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described implementation Examples are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
[0031] figure 1 , figure 2 , Figure 3A and Figure 3B They are respectively a three-dimensional schematic view of the heat sink 10 according to an embodiment of the present invention, a planar perspective schematic view of the internal structure of the heat sink 10 , a schematic cross-sectional view of the heat sink 10 ...
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The embodiment of the invention provides a heat dissipation plate, a method of making same, and an electronic device with the heat dissipation plate. The heat dissipation plate comprises a shell, a capillary structure layer, a supporting piece structure and heat dissipation liquid, wherein the shell is provided with a first substrate and a second substrate which are oppositely arranged to form a non-vacuum sealed cavity; the capillary structure layer is arranged in the first area of the non-vacuum sealed cavity and defines a first flowing space; the supporting piece structure is arranged in the second area of the non-vacuum sealing cavity and defines a second flowing space; the heat dissipation liquid is contained in the non-vacuum sealed cavity, the liquid amount of the heat dissipation liquid is more than 50% of the total capacity of the first flowing space and the second flowing space, and the heat dissipation liquid flows between the first flowing space and the second flowing space. The heat dissipation plate provided by the invention can realize effective heat dissipation.
Description
technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation plate, a method for manufacturing the heat dissipation plate, and an electronic device with the heat dissipation plate. Background technique [0002] With the improvement of the performance of portable electronic devices, the heat generated by the operation of its electronic components such as computing processors, graphics processors or communication function chips is getting higher and higher. Designing a heat dissipation structure that can take into account effective heat dissipation and thin size has become a necessary requirement. [0003] One of the heat dissipation structures commonly used in portable electronic devices is a Vapor Chamber, which has an evacuated cavity with a capillary structure layer filled with less than 10% Vapor Chamber. The heat dissipation liquid (such as: pure water) is adsorbed on the capillary structure layer to limit ...
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IPC IPC(8): H05K7/20
CPCH05K7/20336F28D15/04F28D15/0233Y02D10/00
Inventor 陈建宇
Owner THERLECT CO LTD