Anti-shake photosensitive component, anti-shake camera module and electronic equipment

Abstract

The invention provides an anti-shake photosensitive component, an anti-shake camera module and electronic equipment. The anti-shake photosensitive assembly comprises a circuit board which comprises aconfiguration surface; a driver which is arranged on the configuration surface of the circuit board and comprises a driving part and a fixing part which are electrically connected, wherein the fixingpart is arranged on one side of the driving part; a photosensitive element which is arranged on one side, deviating from the circuit board, of the driving part of the driver and is electrically connected with the driving part; and a substrate which is arranged on the configuration surface of the circuit board and electrically connected with the circuit board, wherein the substrate is located on the side, deviating from the driving part, of the fixing part, a containing groove is formed in the side, close to the fixing part, of the substrate, and at least part of the fixing part is located in the containing groove and electrically connected with the substrate. According to the anti-shake photosensitive assembly, the photosensitive element is moved through the driving part of the driver to realize the anti-shake function of the anti-shake camera module; at least part of the fixing part of the driver is located in the containing groove, so that the fixing part can be effectively protectedby the substrate when the anti-shake camera module falls off, and the imaging quality is relatively stable.

Description

technical field [0001] The present application relates to the field of optical imaging technology, in particular to an anti-shake photosensitive component, an anti-shake camera module and electronic equipment. Background technique [0002] In recent years, more and more electronic products and smart devices are developing in the direction of miniaturization and high performance. Consumers have put forward more stringent requirements on the size and imaging capabilities of the camera modules of such devices. This has also caused most of the existing electronic products and smart devices to pursue the compactness and functional integration of the camera module, and the anti-shake function is integrated into the camera module in this wave of development. Realize the anti-shake function of the camera module. [0003] With the emergence of micro-electro-mechanical systems (Micro-Electro-Mechanic System, referred to as MEMS), the anti-shake function in the prior art is achieved b...

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Problems solved by technology

In the process of implementing the present application, the inventor found that there are at least the following problems in the prior art: the place where the camera module receives the greatest impact force when it falls is between the circuit board and the MEMS. There is a problem of poor drop, which affects the imaging quality of the camera module

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