Method for producing mount structure of electronic component, mount structure of electronic component, electronic module and wiring sheet
A technology for electronic components and mounting structures, which is applied in the structural connection of printed circuits, assembling printed circuits with electrical components, and printed circuit components, etc., can solve the problems of troublesome cost, high cost, and difficulty in forming conductor patterns of wiring boards. achieve the effect of avoiding cost increases
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no. 1 approach
[0037] Figure 2A with Figure 2B The first embodiment of the mounting structure of the electronic component is shown. In this embodiment, first, the electronic module 50 is manufactured, and then the electronic module 50 is attached to the wiring board 40 using an adhesive.
[0038] The electronic module 50 includes a wiring sheet 60 and an electronic component 70 on which the wiring sheet 60 is mounted. The electronic part 70 has a cubic shape in this example, and has four terminals 71 on a bottom surface 70a of the electronic part 70 (see Figure 3A with 3B ).
[0039] The wiring sheet 60 has a structure in which an elastically deformable insulating adhesive layer 62 is formed on one surface 61a of the base 61, and a conductive pattern 63 is further formed on the adhesive layer 62 (see Figure 4A , Figure 4B ). The adhesive layer 62 is formed on the entire surface of one side 61 a of the base 61 .
[0040] In this embodiment, the conductor pattern 63 includes four ...
no. 2 approach
[0060] The conductor pattern of the wiring sheet functions to connect the terminals of the electronic component and the conductor pattern of the wiring board. In the first embodiment, the two conductive wires 63a of the conductive pattern 63 extend in parallel at predetermined intervals on the right side of the electronic component 70, and the remaining two conductive wires 63a of the conductive pattern 63 extend at predetermined intervals on the left side of the electronic component 70. The arrangement intervals extend in parallel (see Figure 4A ). However, in the second embodiment, the conductor pattern of the wiring sheet includes two or more conducting wires whose pitch varies in the extending direction of two adjacent conducting wires. Image 6 The mounting structure of the electronic component of 2nd Embodiment is shown. In each figure, only a part of the wiring board 110 on which the electronic component 80 is mounted is shown.
[0061] The electronic component 80 i...
no. 3 approach
[0068] In the first embodiment and the second embodiment, the wiring board 40 and the wiring board 110 are flexible printed wiring boards, and the material of the base 41 and the base 111 is a flexible film base material. However, the material of the base 41 and the base 111 may also be a non-flexible hard base material.
[0069] As long as conditions such as the thickness of the adhesive layer are sufficient and mechanical bonding by adhesion is achieved, either or both of the base of the wiring board and the base of the wiring sheet may be made of a hard base material.
[0070] As a third embodiment, Figure 11 A mounting structure of an electronic component 150 is shown in which the base 121 of the wiring board 120 and the base 141 of the wiring sheet 140 of the electronic module 130 are each made of a hard base material.
[0071] For example, if a thick adhesive layer 142 is formed compared with a sufficiently small and thin chip resistor, that is, the electronic part 150...
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